GigaDevice Semiconductor (Beijing) Inc. announced the launch of 128Mb SPI NOR Flash, GD25LE128EXH, in the ultra-compact 3x3x0.4mm FO-USON8 package. With its thickness of only 0.4mm, the GD25LE128EXH offers designers unparalleled flexibility in designing compact applications, making it the ideal code storage unit for IoT, wearables, healthcare, and networking products that demand high functionality and low power consumption. As a product of GigaDevice's low power SPI NOR Flash series, the GD25LE128EXH features outstanding performance, with a maximum frequency of 133MHz and a data throughput of up to 532Mbit/s, significantly enhancing system access speed and instant-on capability.

Compared to other industry products, the GD25LE128EXH operates at a lower read current of only 6mA when running at 4-channel 133MHz frequency, reducing the power consumption by 45% and effectively extending battery life. The GD25LE128EXH achieves an ultra-small size for 128Mb products by using the new FO-USON8 package, which reduces area by 70% and thickness by 50%, compared to the conventional 6x5x0.8mm WSON8 package typically used for such products. As a result, GD25LE128EXH takes up 85% less space and reduces material cost.

The 3x3x0.4mm FO-USON8 GD25LE128EXH is also pin compatible with 64Mb and lower capacity 3x4x 0.6mm USON8 products, enabling quick density upgrades to 128Mb without changing the PCB layout. The GD25LE128EXH is currently in mass production.