Hosiden : Low-cost Bluetooth Low Energy Module Lineup Supporting Bluetooth®5
December 05, 2021 at 07:32 pm EST
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2021/12/06
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Low-cost Bluetooth Low Energy Module Lineup Supporting Bluetooth®5
Hosiden has developed a low-cost Bluetooth® Low Energy Module supporting Bluetooth Version5 for the mass market. Applying a Nordic nRF5280 to use as its SoC (System on Chip), this module incorporates a 64MHz Arm® Cortex®-M4 processor and 192kB of flash memory and 24kB of RAM. It gives 2M mode introduced from Bluetooth 5.0, and further it plans to have the Bluetooth version 5.1 certification. The wireless authentication to be obtained is from Japan, USA, and Canada, which can simplify the certification process required for the customers to sell their products and enhance their global reach.
Applying a castellated hole style for the module mounting not only enables easy confirmation of soldering status after mounting to the main board, but also allows excellent mounting integrity and resistance to impact. Furthermore, the high-performance pattern antenna incorporated has realized stable communication performance within a compact body.
Up to 10 GPIO terminals are included, minimized functionality has contributed a reasonable and minimal cost. This product is an ideal choice for small-sized wireless applications for mass production such as sensor beacons, medical devices, and toys. Hosiden will continuously deliver optimum solutions to customers by further expanding our module lineup according to application needs.
Product Name and Model Number
[Product Name]
・Bluetooth® Low Energy module
[Model Number]
・HRM1092
Principal Features
・Stable communication via high-performance antenna
・Low cost
Application
・Beacons
・Toys
・Other wireless products
Production and Sales Plan
Sample production start
December, 2021
Sales start
June, 2022
Planned monthly production
100,000 pcs
Sample price
3,000 JPY
Main Specifications
Item
Specifications
Bluetooth version
5.1 planned
Memory
192 kB Flash / 24 kB SRAM
Power voltage
1.7 to 3.6V
Operation temperature range
-40 to 85ºC
Antenna
Incorporated
External dimensions
9.8 x 15.5 x 1.8 mm
Maximum GPIO terminals
10 terminals
Mounting module
SMT (16 terminals, castellated hole)
*The word mark and logo of Bluetooth® are the registered trademarks of Bluetooth SIG, Inc.
*ARM, Cortex are either the registered trademarks or the trademarks of ARM Ltd. in the United States and other countries.
Please click here for questions to us
https://www.hosiden.com/en/contact.html
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Disclaimer
Hosiden Corporation published this content on 06 December 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 06 December 2021 00:31:02 UTC.
Hosiden Corporation is principally engaged in the manufacture and sale of electronic components. The Company has four business segments. The Mechanical Component segment provides connectors, jacks and switches. The Acoustic segment offers microphones, headphones, headsets, speakers and receivers. The Liquid Crystal Display Device segment provides passive liquid crystal display devices. The Composite Part and Others segment offers remote controllers and solenoids.