Intevac Announces MATRIX Order for Fan-Out Applications in the Advanced Semiconductor Packaging Market
March 24, 2021 at 09:00 am EDT
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Intevac, Inc. announced an INTEVAC MATRIX® PVD order for fan-out applications in the advanced semiconductor packaging market. This order follows the successful completion of the fan-out evaluation program with a leading outsourced assembly and test company (OSAT) in March 2021, and the system will be both booked and recognized as revenue in the first quarter of 2021. Semiconductor device packaging technology in general, and fan-out wafer-level packaging (FOWLP) /fan-out panel-level packaging (FOPLP) technology in particular, is being driven by the strong cost advantages these advanced packaging technologies offer over the expense of implementing continued Moore’s Law progress for sub-10nm semiconductor IC process nodes. Fan-out packaging provides for increased I/O (Input/Output) density for a given semiconductor device while simultaneously supporting smaller die sizes, thereby reducing the amount of space integrated circuit content occupies in handheld consumer electronic products, such as smartphones, wearables, and Internet of Things (IoT) devices. The INTEVAC MATRIX is a high-productivity, substrate-independent thin-film processing platform that is well-positioned for multiple fan-out packaging applications. The MATRIX Physical Vapor Deposition (PVD) system offers a much-reduced cost of ownership (COO) over the current PVD process tools being used for Redistribution Layer (RDL) barrier/seed layer applications, and also offers the flexibility to run multiple substrates on the same system, from wafer-level (round) substrates to panel-level (square or rectangular) substrates, which March 24, 2021 are up to 600mm in size.
Intevac, Inc. is a provider of thin-film process technology and manufacturing platforms for high-volume manufacturing environments. The Company operates through a single segment, which is Thin Film Equipment (TFE). The TFE segment designs, develops and markets vacuum process equipment solutions for high-volume manufacturing of small substrates with precise thin-film properties, such as for the hard disk drive (HDD) and advanced coatings (ADVC) markets, as well as other adjacent thin-film markets. In HDD Equipment Market, it designs, manufactures, markets and services complex capital equipment used to deposit thin films and lubricants onto substrates to produce magnetic disks. In ADVC Market, the Company develops equipment to deposit optically transparent thin films onto display cover panels typically found on consumer and automotive electronics products. Its products include 200 Lean Disk Sputtering System, TRIO, and upgrades, spares, consumables and services (non-systems business).