JAPAN MATERIAL Co., Ltd.

Equities

6055

JP3389680004

Semiconductor Equipment & Testing

Delayed Japan Exchange Other stock markets 10:29:09 2024-04-29 pm EDT			5-day change	1st Jan Change
2,257 ^JPY	+2.68%		+2.82%	-10.08%

Feb. 22	Japan Material's Attributable Profit Down 40.7% in Fiscal Due to Decline in Production	MT
2023	Japan Material's Fiscal H1 Attributable Profit Nearly Halves on Business Units' Weakness	MT

JAPAN MATERIAL Co., Ltd. and Aldon Technologies Services Pte Ltd agreed to acquire 70% stake in Gbs Pte. Ltd. from Pang Chan Yew, Derrick and Bock Chak Boon for $17.15 million.

July 20, 2023

JAPAN MATERIAL Co., Ltd. (TSE:6055) and Aldon Technologies Services Pte Ltd agreed to acquire 70% stake in Gbs (singapore) Pte. Ltd. from Pang Chan Yew, Derrick and Bock Chak Boon for $17.15 million on July 21, 2023. The transaction is expected to be completed in August 2023.

Latest news about JAPAN MATERIAL Co., Ltd.

Japan Material's Attributable Profit Down 40.7% in Fiscal Due to Decline in Production	Feb. 22	MT
Japan Material's Fiscal H1 Attributable Profit Nearly Halves on Business Units' Weakness	Nov. 22	MT
Japan Material’s Attributable Profit Falls 39.7% in Fiscal Q1 on Lower Production, Late Delivery and Higher Labour Costs	23-08-23	MT
JAPAN MATERIAL Co., Ltd. Provides Consolidated Earnings Guidance for the First Half and Full Year Ending March 31, 2024	23-08-08	CI
Japan Material Co., Ltd. Announces Dividend Forecast for the Year Ended March 31, 2024	23-08-08	CI
JAPAN MATERIAL Co., Ltd. and Aldon Technologies Services Pte Ltd completed the acquisition of 70% stake in Gbs Pte. Ltd. from Pang Chan Yew, Derrick and Bock Chak Boon.	23-08-03	CI
JAPAN MATERIAL Co., Ltd. and Aldon Technologies Services Pte Ltd agreed to acquire 70% stake in Gbs Pte. Ltd. from Pang Chan Yew, Derrick and Bock Chak Boon for $17.15 million.	23-07-20	CI
JAPAN MATERIAL Co., Ltd. Provides Consolidated Earnings Guidance for the Six Months Ending September 30, 2023, and the Year Ending March 31, 2024	23-05-26	CI
JAPAN MATERIAL Co., Ltd. Reports Earnings Results for the Full Year Ended March 31, 2023	23-05-12	CI
JAPAN MATERIAL Co., Ltd. Provides Dividend Guidance for the Year Ending March 31, 2024	23-05-11	CI
Japan Material Co., Ltd. Announces Dividend for the Year Ended March 31, 2023, Payable on June 29, 2023	23-05-11	CI
Japan Material Co., Ltd. Provides Earnings Guidance for the Six Months Ending September 30, 2023, and the Year Ending March 31, 2024	23-05-11	CI
Toshiba Appeals to High Court as District Court's Decision on 2015 Lawsuit Fails to Satisfy	23-04-14	MT
Tokyo Court Holds Three Former Toshiba Executives Liable Under 2015 Lawsuit	23-03-28	MT
Japan Material Posts 35% Jump in Fiscal Nine-month Profit	23-02-23	MT
JAPAN MATERIAL Co., Ltd. Provides Consolidated Earnings Guidance for the Full Year Ending March 31, 2023	23-02-21	CI
JAPAN MATERIAL Co., Ltd. Provides Dividend Guidance for the Year End of Fiscal Year 2022	23-02-21	CI
JAPAN MATERIAL Co., Ltd. Provides Consolidated Earnings Guidance for the Full Year Ending March 31, 2023	22-11-20	CI
JAPAN MATERIAL Co., Ltd. Provides Dividend Guidance for the Year End of Fiscal Year 2022	22-11-20	CI
Tranche Update on JAPAN MATERIAL Co., Ltd.'s Equity Buyback Plan announced on May 24, 2018.	18-05-24	CI
JAPAN MATERIAL Co., Ltd.'s Equity Buyback announced on May 24, 2018 has closed with 150,000 shares, representing 0.15% for ¥252.75 million.	18-05-24	CI
JAPAN MATERIAL Co., Ltd.'s Equity Buyback announced on May 24, 2018 has closed with 150,000 shares, representing 0.15% for ¥252.75 million.	18-05-24	CI
JAPAN MATERIAL Co., Ltd. announces an Equity Buyback for 150,000 shares, representing 0.15% for ¥252.75 million.	18-05-24	CI
JAPAN MATERIAL Co., Ltd. authorizes a Buyback Plan.	18-05-23	CI
Tranche Update on JAPAN MATERIAL Co., Ltd.'s Equity Buyback Plan announced on May 11, 2018.	18-05-13	CI

Chart JAPAN MATERIAL Co., Ltd.

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Company Profile

Japan Material Co Ltd is a Japan-based company mainly engaged in the electronics-related business, graphics solution business and solar power generation business. The Company operates in three business segments. The Electronics-related segment is mainly engaged in the manufacture of special gas supply equipment, design and construction of supply piping, sale management of special gas, as well as the provision of technical services. The Graphics Solution segment is mainly engaged in the sale of graphic boards and digital signage related products. The Solar Power Generation segment is engaged in the sale of electricity to electric power companies by solar power generation.

Sector

Semiconductor Equipment & Testing

Calendar

2024-05-12 - Q4 2023 Earnings Release

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Ratings for JAPAN MATERIAL Co., Ltd.

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Analysts' Consensus

Sell

Buy

Mean consensus

BUY

Number of Analysts

Last Close Price

2,198 JPY

Average target price

2,725 JPY

Spread / Average Target

+23.98%

Consensus

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Quarterly earnings - Rate of surprise

Company calendar

Sector Semiconductor Machinery Manufacturing

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Semiconductor Machinery Manufacturing