Lanner Electronics and Compal Electronics announced the availability of the joint 5G Open RAN Solution built with Lanner's DU/CU network appliances and Compal's O-RAN inline acceleration card. The joint solution delivers a programmable, fully disaggregated 5G RAN platform with high efficiency in data transfer and power consumption. To enable high-performance, low-latency communications for 5G vertical applications, Lanner offers the interoperable Open DU/CU network appliances ECA-4027 equipped with Compal's in-line acceleration card designed to offload the CPU loading with reduced power.

According to the latest benchmark testing, ECA-4027 integrated with Compal's in-line acceleration card can achieve 44% CPU computing resources with 17% less energy, making it an ideal platform to enable Kubernetes-containerized 5G RAN applications. Powered by 12-16 cores Intel® Xeon® D-2100 series processor (codenamed Skylake-D), the ECA-4027 is a 37cm short-depth CU/DU edge server, offering 8x 10G SFP+ ports, -40 to 65°C wide operating temperature range, Intel® QAT crypto acceleration, IEEE 1588v2 Time Sync support and PCI-E expansion capability for in-line acceleration. Compal's inline high-PHY accelerator card (codenamed McLaren) is a full-height, 3/4 length FPGA accelerator powered by NXP® Layerscape LX2160 processor, max.

64GB memory and 4x 10/25GbE SFP28 ports. The inline accelerator can unleash the CPU loading from massive data transfer between CPU and accelerator, resulting in improved performance and power efficiency. Additionally, Compal's Teak, the Open RU system powered by NXP®, completes the last piece of 5G Open RAN solutions by supporting 4T4R at 100Mhz with a maximum of 24dBm.