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Malaysian Pacific Industries Berhad Announces Re-Designation of Jenifer Thien Bit Leong, Member of Nomination Committee as Chairman of Nomination Committee CI
Malaysian Pacific Industries Berhad Announces Resignation of Dato' Mohamad Kamarudin Bin Hassan as Independent and Non-Executive Chairman of Nomination Committee CI
Malaysian Pacific Industries Berhad Announces Resignation of Dato' Mohamad Kamarudin Bin Hassan as Independent and Non-Executive Director CI
Malaysian Pacific Industries Berhad Announces Resignation of Dato' Mohamad Kamarudin Bin Hassan as Independent and Non-Executive Member of Audit Committee CI
Malaysian Pacific Industries Berhad Reports Earnings Results for the Second Quarter and Six Months Ended December 31, 2023 CI
Chinese firms look to Malaysia for assembly of high-end chips, sources say RE
Malaysian Pacific Industries to Cease Manufacturing Operations of Unit MT
Malaysian Pacific Industries Berhad Announces the Resignation of Ir Dennis Ong Lee Khian as Independent and Non Executive Director CI
Malaysian Pacific Industries Berhad Announces the Appointment of Miss Jenifer Thien Bit Leong as Independent and Non Executive Member of Audit Committee CI
Malaysian Pacific Industries Berhad Announces the Re-Designation of Miss Foo Ai Li from Member of Audit Committee to Chairman of Audit Committee CI
Malaysian Pacific Industries Berhad Appoints Ir Dennis Ong Lee Khian as Independent and Non Executive Chairman of Audit Committee CI
Malaysian Pacific Industries' Profit Plunges in Fiscal Q1 MT
Malaysian Pacific Industries Berhad Reports Earnings Results for the First Quarter Ended September 30, 2023 CI
Malaysian Pacific Industries Berhad Announces Interim Single-Tier Dividend for the Year Ended June 30, 2024, Payable on December 19, 2023 CI
Malaysian Pacific Industries Berhad Announces Appointment of Jenifer Thien Bit Leong as Independent and Non Executive Member of Nomination Committee CI
Malaysian Pacific Industries Berhad Announces Retirement of Tunku Alina Binti Raja Muhd Alias as Independent and Non Executive Chairman of Nomination Committee CI
Malaysian Pacific Industries Berhad Announces Redesignation of Mohamad Kamarudin Bin Hassan from Independent and Non Executive Member of Nomination Committee to Independent and Non Executive Chairman of Nomination Committee CI
Malaysian Pacific Industries Berhad Announces Appointment of Jenifer Thien Bit Leong as Independent and Non Executive Director CI
Malaysian Pacific Industries Berhad Announces Retirement of Dr Tunku Alina Binti Raja Muhd Alias as Independent and Non Executive Director CI
Malaysian Pacific Industries Berhad Announces Resignation of Eric Cheah Wing Ket as Chief Financial Officer, Effective 01 October 2023 CI
Malaysian Pacific Industries Berhad Appoints Mr. Lau Ping Ong as Chief Financial Officer, Date of Change 01 Oct 2023 CI
Malaysian Pacific Industries' Profit Plunges in Fiscal Q4 MT
Malaysian Pacific Industries Berhad Reports Earnings Results for the Fourth Quarter and Full Year Ended June 30, 2023 CI
Malaysian Pacific Industries Berhad Announces Second Interim Single Tier Dividend for the Financial Year Ending 30 June 2023, Payable on 21 June 2023 CI
Malaysian Pacific Industries Berhad Reports Earnings Results for the Third Quarter and Nine Months Ended March 31, 2023 CI
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Malaysian Pacific Industries Berhad is an investment holding company. The principal activities engaged by its subsidiaries are that of manufacturing services of semiconductor packaging and testing, and manufacturing and sale of leadframes. The Company's segments are Asia, The United States of America (USA), and Europe. The Company offers a range of turnkey test services for radio frequency, mixed-signal, analog, digital and power devices. The Company’s subsidiaries include Carsem (M) Sdn Bhd, which offers full turnkey solutions for leaded and leadless semiconductor packaging and test services; Carsem Semiconductor (Suzhou) Co., Ltd, which is a provider of outsourced semiconductor packaging and testing in China, focusing on the MLPMicro Leadframes Package (QFN format), flip chip and ball grid array technology; Dynacraft Industries Sdn Bhd (DCI), which is a manufacturer of leadframes in the region; and Carter Resources Sdn Bhd.
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Trading Rating
Investor Rating
ESG Refinitiv
B-
More Ratings
Sell
Consensus
Buy
Mean consensus
HOLD
Number of Analysts
6
Last Close Price
29.94 MYR
Average target price
28.14 MYR
Spread / Average Target
-6.01%
Consensus
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