Provided by: NAN YA PRINTED CIRCUIT BOARD CORPORATION
SEQ_NO
3
Date of announcement
2022/07/25
Time of announcement
15:48:20
Subject
To announce the appointment of Chief Information
Security Officer
Date of events
2022/07/25
To which item it meets
paragraph 8
Statement
1.Type of personnel changed (please enter: spokesperson, acting
spokesperson, important personnel (CEO, COO, CMO, CSO, etc.)
,financial officer, accounting officer, corporate governance officer,
chief information security officer, research and development officer,
chief internal auditor, or designated and non-designated representatives):
Chief Information Security Officer
2.Date of occurrence of the change:2022/07/25
3.Name, title, and resume of the previous position holder:None
4.Name, title, and resume of the new position holder:
Yi-Cheng Chen, Senior Administrator of President Office, Nan Ya PCB
5.Type of the change (please enter: "resignation", "position
adjustment", "dismissal", "retirement", "death" or "new
replacement"):New replacement
6.Reason for the change:New replacement
7.Effective date:2022/08/01
8.Any other matters that need to be specified:None
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Disclaimer
NYPCB – Nan Ya Printed Circuit Board Corporation published this content on 25 July 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 25 July 2022 08:03:10 UTC.
Nan Ya Printed Circuit Board Corp is a Taiwan-based company principally engaged in the manufacture and sales of printed circuit boards (PCBs). The Companyâs products include ordinary PCBs and substrates for integrated circuit (IC) carrier boards. Ordinary PCBs are mainly used in notebook computers, workstations, servers, high-end memory modules, game consoles, set-top boxes, automobiles, light-emitting diode (LED) displays, mobile phone peripherals, and wireless charging. IC carrier boards are mainly used in various electronic products, including optical sensors, cloud server chips, artificial intelligence (AI) chips, 8K television chips, road monitors, artificial intelligence chips, 5G wireless communication modules and others. The Company provides products in Taiwan, mainland China, the United States and other countries.