Hong Kong Exchanges and Clearing Limited and The Stock Exchange of Hong Kong Limited take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement.

SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION

中芯國際集成電路製造有限公司*

(Incorporated in the Cayman Islands with limited liability) (Stock Code: 981)

FULL CONVERSION OF CONVERTIBLE BONDS DUE 2018

Reference is made to: (i) the announcements of Semiconductor Manufacturing International Corporation (the "Company") dated 25 October 2013, 7 November 2013 and 18 December 2013 in relation to the zero coupon convertible bonds with an initial aggregate principal amount of US$200 million due 2018 issued by the Company (together with the zero coupon convertible bonds with an aggregate principal amount of US$86.8 million issued to both Datang Holdings (Hong Kong) Investment Company Limited and Country Hill Limited pursuant to the exercise of their pre-emptive rights in connection with the subscription agreement for this issuance); and (ii) the announcements of the Company dated 4 June 2014, 18 June 2014 and 24 June 2014 in relation to the zero coupon convertible bonds with an initial aggregate principal amount of US$95 million due 2018 issued by the Company (together with the zero coupon convertible bonds with an aggregate principal amount of US$22.2 million issued to both Datang Holdings (Hong Kong) Investment Company Limited and Country Hill Limited pursuant to the exercise of their pre- emptive rights in connection with the subscription agreement for this issuance) (the "Bonds").

On 3 March 2017, the Company received notices from all holders of the Bonds for the full conversion of the outstanding Bonds in accordance with the respective terms and conditions of the Bonds. As all outstanding Bonds have been fully converted and no Bonds remain outstanding, no redemption of the Bonds will be carried out.

As all outstanding Bonds have been fully converted and no Bonds remain outstanding, the Company will arrange for the delisting of the Bonds from the Singapore Exchange Securities Trading Limited.

Semiconductor Manufacturing International Corporation

Dr. Tzu-Yin Chiu

Chief Executive Officer and Executive Director

Shanghai, 10 March 2017

As at the date of this announcement, the directors of the Company are:

Executive Directors

Zhou Zixue (Chairman)

Tzu-Yin Chiu (Chief Executive Officer) Gao Yonggang (Chief Financial Officer)

Non-executive Directors

Chen Shanzhi Zhou Jie

Ren Kai Lu Jun

Tong Guohua

Independent Non-executive Directors

William Tudor Brown Lip-Bu Tan

Carmen I-Hua Chang Shang-yi Chiang Jason Jingsheng Cong

* For identification purposes only

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SMIC - Semiconductor Manufacturing International Corporation published this content on 10 March 2017 and is solely responsible for the information contained herein.
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