Shenzhen Tigo Semiconductor Co., Ltd. announced that it has signed a investment agreement to receive CNY 6,530,891 on March 19, 2024. The transaction will include participation from new investor Shanghai Sunglow Packaging Technology Co.,Ltd. The transaction has been approved by the 19th session of the company?s 3rd directorate. After the transaction, Shenzhen Tigo Semiconductor Co., Ltd.'s registered capital will increase from CNY 58,778,022 to CNY 65,308,913.

The company will issue common shares in the transaction.