Guangzhou Guangxin Packaging Substrate Co., Ltd. announced that it will receive CNY 300,000,000 in an equity round of funding on March 11, 2022. The transaction will include participation from returning investor Shennan Circuit Company Limited to retain its 100% stake in the company. Post completion of the transaction, the capital of the company will increase from CNY 200,000,000 to CNY 500,000,000.

The transaction has been approved by the board of directors of Shennan Circuit Company Limited in the 14th Meeting of the Company's 3rd Directorate.