Spectra7 Microsystems Inc. announced that it will be demonstrating 800Gbps QSFP-DD and OSFP interconnects with several leading equipment suppliers at this year's annual DesignCon Conference Exhibition being held in Santa Clara, California from Jan 31- Feb. 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable products for hyperscale data center applications.

DesignCon is the premier high speed interconnect and system design conference attended by engineers from around the world. Spectra7 will be exhibiting in booth #1344. Spectra7's analog based GaugeChangerTM GC1122 chips are used in Active Copper Cables (ACCs) and offer significant cost, size and energy consumption value vs.

competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies.