Inactive Instrument

Subtron Technology Co., Ltd

8179

TW0008179003

Subtron Technology Co., Ltd authorizes a Buyback plan.

August 31, 2017

The Board of Directors of Subtron Technology Co., Ltd has authorized a buyback plan August 1, 2017.

Latest news about Subtron Technology Co., Ltd

Subtron Technology Co., Ltd Reports Earnings Results for the Half Year Ended June 30, 2022	22-07-21	CI
Unimicron Technology Corp. agreed to acquire remaining 67.82% stake in Subtron Technology Co., Ltd for TWD 10.8 billion.	22-02-21	CI
Subtron Technology Co., Ltd Reports Earnings Results for the Full Year Ended December 31, 2021	22-02-21	CI
Subtron Technology Co., Ltd Reports Earnings Results for the Half Year Ended June 30, 2021	21-07-22	CI
Subtron Technology Co., Ltd Reports Earnings Results for the Full Year Ended December 31, 2020	21-02-03	CI
Subtron Technology Co., Ltd Reports Earnings Results for the Full Year Ended December 31, 2019	20-02-19	CI
Subtron Technology Co., Ltd Reports Earnings Results for the Half Year Ended June 30, 2019	19-08-05	CI
Subtron Technology Co. Ltd. Reports Earnings Results for the Full Year Ended December 31, 2018	19-03-11	CI
Subtron Technology Co., Ltd's Equity Buyback announced on August 1, 2017, has expired.	17-09-30	CI
Subtron Technology Co., Ltd announces an Equity Buyback for 3,000,000 shares, representing 1.05% for TWD 30 million.	17-07-31	CI
Subtron Technology Co., Ltd authorizes a Buyback plan.	17-07-31	CI
Subtron Technology Co. Ltd.’s Equity Buyback announced on September 24, 2013 has expired.	13-11-21	CI
Tranche Update on Subtron Technology Co. Ltd.'s Equity Buyback Plan announced on September 24, 2013.	13-11-21	CI
Subtron Technology Co. Ltd. authorizes a Buyback plan.	13-09-23	CI
Subtron Technology Co. Ltd. announces an Equity Buyback for 10,000,000 shares, representing 3.38% for TWD 125 million.	13-09-23	CI

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SUBTRON TECHNOLOGY CO., LTD. is a Taiwan-based company principally engaged in the manufacture, processing and distribution of integrated circuit (IC) substrates. The Company's main products include IC package substrates, chip scale packages (CSPs), light emitting diodes (LEDs), chips on film (COF), flexible printed circuits (FPCs), radio frequency (RF) IC substrates, tape automated bonding (TAB) FPCs, ink cartridge (INK) FPCs, as well as electronic parts and components, among others. Its products are applied in the manufacture of ICs and electronic products. The Company distributes its products in domestic market and to overseas markets, including the rest of Asia, the Americas and Europe.

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