Systena Corporation Announces Dividend for the Year Ended March 31, 2023, Payable on June 7, 2023; Provides Dividend Guidance for the Second Quarter Ending September 30, 2023 and Year Ending March 31, 2024
May 10, 2023
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Systena Corporation announced dividend for the year ended March 31, 2023, Payable on June 7, 2023 and provided dividend guidance for the second quarter ending September 30, 2023 and year ending March 31, 2024. The company announced dividend of JPY 4.00 per share for the year ended March 31, 2023.
For the second quarter ending September 30, 2023 and full year ending March 31, 2024, the company expects to pay the dividend of JPY 5.00 per share.
Systena Corporation is a Japan-based company principally engaged in the business related to information technology (IT). The Company operates in eight segments. Solution Design segment engages in the provision of automatic operation, in-vehicle system, carrier service and others. Framework Design segment develops financial, industrial, public, and other key systems and develops basic systems. IT Service segment is engaged in the operation and maintenance of systems and networks, the provision of services of user support and data inputting, among others. Solution segment sells IT-related products and operates system integration business. Cloud segment sells and installs cloud software. Consumer Service segment plans, develops and sells game content for smartphones and tablets. Overseas segment is engaged in the solution business in overseas markets. Investment Development segment conducts new business.
Systena Corporation Announces Dividend for the Year Ended March 31, 2023, Payable on June 7, 2023; Provides Dividend Guidance for the Second Quarter Ending September 30, 2023 and Year Ending March 31, 2024
SYSTENA CORPORATION 
