Inactive Instrument

ThinFlex Corporation

3144

TW0003144002

ThinFlex Corporation Announces Board Appointments

July 01, 2021 at 05:44 am EDT

ThinFlex Corporation announced appointment of Masuda Takeshi and Chen,Chun-Sheng as directors, effective July 1, 2021.

Latest news about ThinFlex Corporation

ThinFlex Corporation announced that it expects to receive ¥2.3 billion in funding from Arisawa Mfg. Co., Ltd.	22-01-26	CI
ThinFlex Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	21-11-03	CI
Thinflex Corporation Reports Earnings Results for the Second Quarter Ended June 30, 2021	21-08-03	CI
ThinFlex Corporation Announces Change of Remuneration Committee	21-07-19	CI
ThinFlex Corporation Announces Cash Dividend for 2020, Payable on Sep. 30, 2021	21-07-19	CI
Arisawa Mfg. Co., Ltd. entered into share transfer agreement to acquire remaining 10.5% stake in ThinFlex Corporation for approximately TWD 410 million.	21-07-18	CI
ThinFlex Corporation Appoints Chen,Chun-Sheng as Member of Audit Committee	21-07-01	CI
ThinFlex Corporation Announces Board Appointments	21-07-01	CI
ThinFlex Corporation Appoints Chan,Cheng-Huang to Remuneration Committee, Effective May 11,2021	21-05-11	CI
Thinflex Corporation Reports Earnings Results for the First Quarter Ended March 31, 2021	21-05-10	CI
ThinFlex Corporation Appoints Liu, Chin-Hung as Chairman	21-04-20	CI
ThinFlex Corporation Announces the Resignation of Chia-Neng Huang as Natural-Person Director of the Company	21-04-16	CI
ThinFlex Corporation Announces Resignation of Huang, Chia-Neng as Chairperson	21-04-16	CI
ThinFlex Corporation Proposes Dividend Distribution for the 2020	21-04-06	CI
Thinflex Corporation Announces Resignation of Chief Internal Auditor	21-03-25	CI
Thinflex Corporation Reports Earnings Results for the Full Year Ended December 31, 2020	21-03-21	CI
ThinFlex Corporation Announces Resignation of Chen Li Ming as Independent Director, Member of Audit Committee and Remuneration Committee, Effective May 9, 2021	21-02-26	CI
ThinFlex Corporation Announces Management Changes	21-02-26	CI
Arisawa Mfg. Co., Ltd. completed the acquisition of additional 32.2% stake in ThinFlex Corporation from Chang Wah Electromaterials Inc. and others for TWD 1.2 billion.	21-01-25	CI
Arisawa Mfg. Co., Ltd. made an offer to acquire remaining 47.7% stake in ThinFlex Corporation from Chang Wah Electromaterials Inc. and others for TWD 1.7 billion.	20-12-01	CI
Thinflex Corporation Reports Earnings Results for the Third Quarter Ended September 30, 2020	20-11-09	CI
Thinflex Corporation Reports Earnings Results for the Second Quarter Ended June 30, 2020	20-08-11	CI
Thinflex Corporation Reports Earnings Results for the First Quarter Ended March 31, 2020	20-05-11	CI
Thinflex Corporation Reports Earnings Results for the Third Quarter Ended September 30, 2019	19-11-07	CI
Thinflex Corporation Reports Earnings Results for the Second Quarter Ended June 30, 2019	19-08-07	CI

ThinFlex Corporation is a Taiwan-based company principally engaged in the manufacture and distribution of flexible copper clad laminates (FCCLs) and related materials. The Company provides FCCLs, which are mainly applied in the manufacture of mobile phones, medical equipment, aerospace products, liquid crystal display (LCD) panels, cameras, printers, facsimile machines, photocopiers, computers, disk players, industrial equipment and scanners, among others, as well as coverlays, which are mainly applied in the manufacture of cameras, notebook computers, handheld computers, printers, scanners, and mobile phones, among others. It distributes its products in domestic market, and the rest of Asia and Europe markets.

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Semiconductors

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