United Microelectronics : Supplement to the unsecured straight corporate bond issuance authorized by the Board of Director resolution passed on February 24th, 2021
Supplement to the unsecured straight corporate
bond issuance authorized by the Board of Director
resolution passed on February 24th, 2021
Date of events
2021/12/08
To which item it meets
paragraph 11
Statement
1.Date of the board of directors resolution:NA
2.Name [issue no.__ of (secured, unsecured) corporate bonds of
___________ (company)]:
United Microelectronics Corporation 2nd unsecured straight corporate
bond issuance in 2021
3.Total amount issued:NT$5,000 million
4.Face value per bond:NT$1 million
5.Issue price:At par
6.Issuance period:5 years
7.Coupon rate:Fixed rate at 0.63% p.a.
8.Types, names, monetary values and stipulations of collaterals:N/A
9.Use of the funds raised by the offering and utilization plan:
purchase of equipment
10.Underwriting method:Public offering through underwriter
11.Trustees of the corporate bonds:CTBC Bank Co., Ltd
12.Underwriter or agent:MasterLink Securities Co., Ltd as the lead underwriter
13.Guarantor(s) for the issuance:None
14.Agent for payment of the principal and interest:CTBC Bank Co., Ltd
15.Certifying institution:None
16.Where convertible into shares, the rules for conversion:N/A
17.Sell-back conditions:None
18.Buyback conditions:None
19.Reference date for any additional share exchange, stock swap, or
subscription:N/A
20.Possible dilution of equity in case of any additional share exchange,
stock swap, or subscription:N/A
21.Any other matters that need to be specified:None
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UMC - United Microelectronics Corporation published this content on 08 December 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 08 December 2021 09:31:08 UTC.
United Microelectronics Corp is a global semiconductor foundry. The Company provides integrated circuit (IC) production for applications spanning every sector of the electronics industry. The Company operates through two segments. The Wafer Fabrication segment is mainly engaged in the manufacture of chips to the design specifications of its customers by using its own processes and techniques. The New Business segment is engaged in the research, development, manufacture and provision of solar energy. The Company is engaged in the maintenance of a customer base across various industries, including communication, consumer electronics, computer, memory, new generation light-emitting diode (LED) and others, while focusing on manufacturing for applications, including networking, telecommunications, Internet, multimedia, personal computers (PCs) and graphics.
United Microelectronics : Supplement to the unsecured straight corporate bond issuance authorized by the Board of Director resolution passed on February 24th, 2021
UNITED MICROELECTRONICS CORPORATION 
