To announce the registration of capital reduction
due to cancellation of the RSA
Date of events
2021/11/30
To which item it meets
paragraph 36
Statement
1.Date of the competent authority��s approval of capital reduction:2021/11/26
2.Date of completion of capitalization change registration:2021/11/26
3.Effect on the financial statements (including any discrepancy between the
amount of paid-in capital and the no.of shares outstanding, and the effect
on net worth per share):
(1)Before the capital reduction: The paid-in capital is NT$124,843,773,340;
the shares outstanding are 12,484,377,334 shares; book value per share is
NT$20.91
(2)After the capital reduction: The paid-in capital is NT$124,832,475,660;
the shares outstanding are 12,483,247,566 shares; book value per share is
NT$20.91
(Note�GNet worth per share was calculated based on the consolidated
financial statements for the first quarter of 2021 reviewed by CPA,
including the effect of share exchange with Chipbond Technology
Corporation on November 5th, 2021.)
4.Plan for expected share replacement operations:NA
5.Estimated no.of listed common shares after capital reduction and new issue:
NA
6.Estimated no.of listed common shares as a percentage of issued common
shares after capital reduction and new issue (No.of common shares after
capital reduction/No.of issued common shares):NA
7.Countermeasures for poor circulation of equity if the aforesaid estimated
no.of listed common shares does not reach 60 million shares and the
percentage does not reach 25% after capital reduction:NA
8.Any other matters that need to be specified:None
Attachments
Original Link
Original Document
Permalink
Disclaimer
UMC - United Microelectronics Corporation published this content on 30 November 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 30 November 2021 10:20:07 UTC.
United Microelectronics Corp is a global semiconductor foundry. The Company provides integrated circuit (IC) production for applications spanning every sector of the electronics industry. The Company operates through two segments. The Wafer Fabrication segment is mainly engaged in the manufacture of chips to the design specifications of its customers by using its own processes and techniques. The New Business segment is engaged in the research, development, manufacture and provision of solar energy. The Company is engaged in the maintenance of a customer base across various industries, including communication, consumer electronics, computer, memory, new generation light-emitting diode (LED) and others, while focusing on manufacturing for applications, including networking, telecommunications, Internet, multimedia, personal computers (PCs) and graphics.
UNITED MICROELECTRONICS CORPORATION 
