The Company's consolidated financial report of 2022Q2
have been approved by the Board of Directors
Date of events
2022/08/12
To which item it meets
paragraph 31
Statement
1.Date of the board of directors submitted or approved:2022/08/12
2.Date of the audit committee approved:2022/08/12
3.Start and end dates of financial reports or unaudited financial
information of the reporting period(XXXX/XX/XX~XXXX/XX/XX):
2022/01/01~2022/06/30
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):10,894,318
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD):3,314,868
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD):1,663,452
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD):1,659,438
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD):1,330,229
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD):1,526,251
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD):3.60
11.Total assets end of the period (thousand NTD):72,767,243
12.Total liabilities end of the period
(thousand NTD):37,796,245
13.Equity attributable to owners of parent end of the
period (thousand NTD):32,928,827
14.Any other matters that need to be specified:None.
Attachments
Original Link
Original Document
Permalink
Disclaimer
WIN Semiconductors Corp. published this content on 12 August 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 12 August 2022 07:29:03 UTC.
WIN Semiconductors Corp is a Taiwan-based company principally engaged in the provision of gallium arsenide wafers original equipment manufacturer (OEM) services. The Company provides semiconductor manufacturing technology and customer-related layout services and wafer automated circuit testing, automated inspection and other services. In the microwave high-tech field of wireless broadband communications, the Company mainly provides heterojunction bipolar transistors (HBT) and pseudomorphic high electron mobility transistors (pHEMT). In optical communications and 3D sensing field, the Company provides the development and manufacturing service of optoelectronic products. The Company is also developing optoelectronic component technology in automotive, data center and fiber-related applications. The Company's products are mainly sold to Asia, America, Europe and Taiwan.