Log in
Forgot password ?
Become a member for free
Sign up
Sign up
Dynamic quotes 

MarketScreener Homepage  >  Equities  >  Nasdaq  >  Ansys    ANSS


My previous session
Most popular
News SummaryMost relevantAll newsOfficial PublicationsSector news

ANSYS : Achieves TSMC Certifications for 7nm FinFET Plus Process Technology and Integrated Fan-Out With Memory on Substrate Advanced...

share with twitter share with LinkedIn share with facebook
share via e-mail
10/02/2018 | 07:12am EST

PITTSBURGH, Oct. 2, 2018 /PRNewswire/ -- ANSYS (NASDAQ: ANSS) announced TSMC certified ANSYS solutions for the 7 nanometer FinFET Plus (N7+) process node with extreme ultraviolet lithography (EUV) technology and validated the reference flow for the latest Integrated Fan-Out with Memory on Substrate (InFO_MS) advanced packaging technology. The certifications and validations are vital for fabless semiconductor companies that require their simulation tools to pass rigorous testing and validation for new process nodes and packaging technologies.

ANSYS® RedHawk™ and ANSYS® Totem™ are certified for TSMC N7+ process technology that provides EUV-enabled features. Certification for N7+ includes extraction, power integrity and reliability, signal electromigration (EM) and thermal reliability analysis.

Industry-leading TSMC InFO advanced packaging technology is extended to integrate memory subsystem with logic die. TSMC and ANSYS enhanced the existing InFO design flow to support the new InFO_MS packaging technology, and validated the reference flow using ANSYS SIwave-CPA, ANSYS® RedHawk-CPA™, ANSYS® RedHawk-CTA™, ANSYS® CMA™ and ANSYS® CSM™ with the corresponding chip models. The InFO_MS reference flow includes die and package co-simulation and co-analysis for extraction, power and signal integrity analysis, power and signal electromigration analysis and thermal analysis.

'TSMC and ANSYS' latest N7+ certification and InFO_MS enablement empowers customers to address growing performance, reliability and power demands for their next generation of chips and packages,' said Suk Lee, Senior Director of Design Infrastructure Marketing Division at TSMC.

'The number of smart, connected electronic devices continues to grow and manufacturers must keep pace to design power efficient, high-performing and reliable products at a lower cost and with a smaller footprint,' said John Lee, General Manager at ANSYS. 'ANSYS semiconductor solutions address complex multi-physics challenges such as power, thermal, reliability and impact of process variation on product performance. ANSYS' comprehensive Chip Package System solutions for chip aware system and system aware chip signoff help mutual customers accelerate design convergence with greater confidence.'

About ANSYS, Inc.

If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, ANSYS is headquartered south of Pittsburgh, Pennsylvania, U.S.A., Visit www.ansys.com for more information.

To join the simulation conversation, please visit: www.ansys.com/Social@ANSYS

ANSYS and any and all ANSYS, Inc. I am brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.


View original content to download multimedia:http://www.prnewswire.com/news-releases/ansys-achieves-tsmc-certifications-for-7nm-finfet-plus-process-technology-and-integrated-fan-out-with-memory-on-substrate-advanced-packaging-technology-300722420.html



ANSYS Inc. published this content on 02 October 2018 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 02 October 2018 11:11:18 UTC

share with twitter share with LinkedIn share with facebook
share via e-mail
Latest news on ANSYS
02/20ANSYS : Expands Materials Teaching Support With New CES EduPack 2019 From Granta
02/12ANSYS : Twin Builder Empowers Organizations to Optimize Product Operations and A..
02/06ANSYS : Recognized As A Leader In Corporate Sustainability
02/05ANSYS : Newly Launched ANSYS Cloud Accelerates Engineering Productivity and Busi..
01/29ANSYS : 2019 R1 Delivers Speed and Ease of Use for Engineers Solving Next-Genera..
01/28ANSYS to Release Fourth Quarter and FY 2018 Earnings on February 27, 2019
01/23ANSYS : and Electromagnetic Crosstalk Solutions Leader Helic Sign Definitive Acq..
01/22ANSYS : And Material Intelligence Leader Granta Design Sign Definitive Acquisiti..
01/21ANSYS : and Electromagnetic Crosstalk Solutions Leader Helic Sign Definitive Acq..
01/16ANSYS : OnScale Expands Leadership and Appoints Dr. Masha Petrova as VP of Marke..
More news
Financials ($)
Sales 2018 1 249 M
EBIT 2018 564 M
Net income 2018 367 M
Finance 2018 835 M
Yield 2018 -
P/E ratio 2018 42,25
P/E ratio 2019 39,28
EV / Sales 2018 11,1x
EV / Sales 2019 9,70x
Capitalization 14 663 M
Duration : Period :
Ansys Technical Analysis Chart | MarketScreener
Full-screen chart
Technical analysis trends ANSYS
Short TermMid-TermLong Term
Income Statement Evolution
Mean consensus OUTPERFORM
Number of Analysts 17
Average target price 184 $
Spread / Average Target 4,8%
EPS Revisions
Ajei S. Gopal President, CEO, Chief Operating Officer & Director
James E. Cashman Chairman
Maria T. Shields CFO, Senior VP-Finance & Administration
Manish Sinha Chief Information Officer
Prithviraj Banerjee Chief Technology Officer
Sector and Competitors
1st jan.Capitalization (M$)
ANSYS22.07%14 663
ADOBE SYSTEMS13.93%126 272
WORKDAY21.93%42 445
AUTODESK25.58%35 372
SQUARE INC34.85%31 459