Ingu Yin Chang
Chief Executive Officer at Vertical Circuits, Inc.
Ingu Yin Chang active positions
| Companies | Position | Start | End |
|---|---|---|---|
Vertical Circuits, Inc.
 Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Chief Executive Officer | 2011-08-08 | - |
| Sales & Marketing | - | 2011-08-08 |
Career history of Ingu Yin Chang
Former positions of Ingu Yin Chang
| Companies | Position | Start | End |
|---|---|---|---|
| LSI CORP | Corporate Officer/Principal | 1988-12-31 | - |
| AMKOR TECHNOLOGY, INC. | Sales & Marketing | - | - |
Training of Ingu Yin Chang
| University of California, Berkeley | Graduate Degree |
Statistics
International
| United States | 5 |
Operational
| Sales & Marketing | 2 |
| Chief Executive Officer | 1 |
| Graduate Degree | 1 |
Sectoral
| Electronic Technology | 4 |
| Consumer Services | 2 |
Positions held
Active
Inactive
Listed companies
Private companies
Linked companies
| Listed companies | 1 |
|---|---|
| AMKOR TECHNOLOGY, INC. | Electronic Technology |
| Private companies | 2 |
|---|---|
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Electronic Technology |
LSI Corp.
 LSI Corp. Electronic ComponentsElectronic Technology LSI Corp. designs, develops, and markets high-performance storage and networking semiconductors. Its products include custom and standard product integrated circuits that are used in disk drives, solid state drives, high-speed communications systems, computer servers, storage systems, and personal computers. The company was founded on November 6, 1980 and is headquartered in San Jose, CA. | Electronic Technology |
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