Toshiyuki Yamagishi
Director/Board Member at CASIO COMPUTER CO., LTD.
Toshiyuki Yamagishi active positions
| Companies | Position | Start | End |
|---|---|---|---|
| CASIO COMPUTER CO., LTD. | Director/Board Member | 2013-05-31 | - |
| Corporate Officer/Principal | 2020-05-31 | - | |
| Chief Administrative Officer | 2009-03-31 | 2010-11-30 | |
| Public Communications Contact | 2019-09-30 | 2020-05-31 | |
Casio Micronics Co., Ltd.
 Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Corporate Officer/Principal | 2012-03-25 | - |
| Director/Board Member | 2011-10-10 | 2012-03-25 | |
| Independent Dir/Board Member | 2011-10-10 | 2012-03-25 |
Career history of Toshiyuki Yamagishi
Statistics
International
| Japan | 3 |
Operational
| Director/Board Member | 2 |
| Corporate Officer/Principal | 2 |
| Independent Dir/Board Member | 1 |
Sectoral
| Electronic Technology | 2 |
| Consumer Durables | 2 |
Positions held
Active
Inactive
Listed companies
Private companies
Linked companies
| Listed companies | 1 |
|---|---|
| CASIO COMPUTER CO., LTD. | Consumer Durables |
| Private companies | 1 |
|---|---|
Casio Micronics Co., Ltd.
Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Electronic Technology |
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