ACM Research, Inc. through its operating subsidiary ACM Research (Shanghai), Inc., introduced the ULTRA C v Vacuum Cleaning Tool to meet the unique flux removal requirements for chiplets and other advanced 3D packaging structures. The new tool, which was developed in collaboration with several key customers, has demonstrated excellent process performance with no flux residual remaining post-clean. ACM also announced that it has received a purchase order from a major Chinese manufacturer for the tool, which it expects to deliver in the first quarter of 2024.

Interest in modular chiplet technologies has grown rapidly as the semiconductor industry looks to alternative architectures for more powerful chips without shrinking the transistor size. This approach combines modular chiplets to form more complex integrated circuits to improve performance, reduce cost and offer increased design flexibility versus traditional monolithic chips. Chiplets are seeing increased adoption across the server, personal computer, consumer electronics and automotive markets.