Cadence Design Systems, Inc. announced that Sequans Communications S.A. has successfully adopted the Cadence® Virtuoso® RF Solution, including the Cadence Spectre® X RF Simulator and Cadence EMX® Planar 3D Solver, for high-frequency RF harmonic balance and electromagnetic (EM) analysis and signoff, to develop its next-generation 5G IoT platform. Sequans also used the Cadence AWR® Visual System Simulator™ (VSS) software to predict and measure overall system performance and functionality in support of the 5G New Radio (NR) and internet of things (IoT) communication standards. The comprehensive, full-suite solution from Cadence enabled Sequans engineers to achieve a 2X performance improvement versus its legacy solution and reduce time to market while ensuring a high level of accuracy. The Sequans RF engineering team leveraged the VirtuosoRF Solution, which has a highly optimized design environment with embedded EM and multi-technology capabilities, to drive robust RF simulation and analyses. Integrating the EMX Planar 3D Solver directly into the Virtuoso Layout Suite EXL environment empowered Sequans engineers to efficiently design and verify critical on-chip and off-chip passive devices and interconnect. The multi-technology capabilities of the Virtuoso RF Solution let integrated circuits (IC)s, packages and boards be combined and co-designed within a single, unified design platform, thereby significantly reducing EM setup time and effort and allowing designers to meet the growing EM requirements of 5G, IoT and other advanced communication standards. Additionally, the seamless interplay of advanced simulation, multiphysics and RF technologies within the Cadence solution delivers a one-of-a-kind, comprehensive and extensible platform for chip, package and board design through to the end-to-end complete system design, analysis and signoff.