Cadence Design Systems, Inc. announced Cadence Celsius Studio, the industry's first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. While current product offerings consist mostly of disparate point tools, Celsius Studio introduces an entirely new approach with a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyze and optimize product performance without the need for geometry simplification, manipulation and/or translation. The result is a streamlined workflow that improves collaboration, reduces design iterations and allows predictable design schedules, which in turn reduces turnaround times and accelerates time to market.

Celsius Studio delivers the following benefits: ECAD/MCAD Unification - Provides seamless integration of design files with no simplification as well as streamlined workflows for fast and efficient in-design analysis; AI Design Optimization - Cadence Optimality Intelligent System Explorer's AI technology within Celsius Studio enables fast and efficient exploration of the full design space to converge on the optimal design; In-Design Analysis of 2.5D and 3d-IC Packages - Delivers unprecedented capacity to analyze any 2.5D and 3 D-IC packages without any simplification or accuracy loss; Micro-to-Macro Modeling - The first solution capable of modeling structures as small as the IC and its power distribution and as large as the chassis where the PCB(s) are placed; Large-Scale Simulation - Accurately simulates large systems with detailed granularity for any object of interest including, chip, package, PCB, fan or enclosure; Multi-Stage Analyses - Enables designers to perform multistage analyses for the design assembly process and addresses 3D-IC warpage issues for multi-die stacks on a single package; True System-Level Thermal Analyses - Combines finite element method (FEM) with computational fluid dynamics (CFD) for full-system thermal analysis from chip to package to board and end-system; Seamless Integration - Integrated with Cadence's implementation platforms, including Virtuoso Layout Suite, Allegro X Design Platform, Innovus Implementation System, Optimality Intelligent System Explorer and AWR Design Environment.