China Wafer Level CSP Co., Ltd.

Equities

603005

CNE100001SM0

Semiconductor Equipment & Testing

End-of-day quote Shanghai S.E. Other stock markets 06:00:00 2024-04-28 pm EDT			5-day change	1st Jan Change
17.56 ^CNY	+3.23%		+9.48%	-20.04%

Apr. 19	China Wafer Level CSP Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	CI
Apr. 03	Tranche Update on China Wafer Level CSP Co., Ltd.'s Equity Buyback Plan announced on February 29, 2024.	CI

Tranche Update on China Wafer Level CSP Co., Ltd.'s Equity Buyback Plan announced on February 29, 2024.

April 02, 2024

From February 28, 2024 to March 31, 2024, the company has repurchased 0 shares, representing 0% for CNY 0 million. With this, the company has completed the repurchase of 0 shares, representing 0% for CNY 0 million under the buyback announced on February 29, 2024.

Latest news about China Wafer Level CSP Co., Ltd.

China Wafer Level CSP Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	Apr. 19	CI
Tranche Update on China Wafer Level CSP Co., Ltd.'s Equity Buyback Plan announced on February 29, 2024.	Apr. 02	CI
China Wafer Level CSP Co., Ltd. announces an Equity Buyback for CNY 25 million worth of its shares.	Feb. 28	CI
China Wafer Level CSP Co., Ltd. authorizes a Buyback Plan.	Feb. 27	CI
China Wafer Level CSP Co., Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2023	23-10-30	CI
China Wafer Level CSP Co., Ltd. Reports Earnings Results for the Half Year Ended June 30, 2023	23-08-25	CI
China Wafer Level CSP to Invest $30 Million to Set Up Singaporean Subsidiary	23-05-11	MT
China Wafer Level CSP Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-04-24	CI
China Wafer Level CSP Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	23-04-24	CI
China Wafer Level CSP to Boost Stake in Dutch Industrial Equipment Maker Anteryon to 81% For 2.7 Million Euros	23-03-28	MT
China Wafer Level CSP Co., Ltd. and Suzhou Jingfang II Integrated Circuit Industry Fund Partnership (Limited Partnership) completed the acquisition of 34% stake in VisIC Technologies Ltd.	23-01-09	CI
China Wafer Level CSP Co., Ltd. and Suzhou Jingfang II Integrated Circuit Industry Fund Partnership (Limited Partnership) agreed to acquire 34.25% stake in VisIC Technologies Ltd. for $50 million.	22-10-30	CI
China Wafer Level CSP Co., Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2022	22-10-30	CI
China Wafer Level CSP Co., Ltd.(XSSC:603005) added to S&P Global BMI Index	22-09-19	CI
China Wafer Level CSP Co., Ltd. Reports Earnings Results for the Half Year Ended June 30, 2022	22-08-26	CI
China Wafer Level CSP Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022	22-04-28	CI
China Wafer Level CSP Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2021	22-04-08	CI
China Wafer Level CSP Co., Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2021	21-10-29	CI
China Wafer Level Csp Co., Ltd. Reports Earnings Results for the Half Year Ended June 30, 2021	21-08-27	CI
China Wafer Level Csp Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2021	21-04-23	CI
Market Chatter: Chinese State-Backed Semiconductor Fund Offloads Stakes in Chip Companies	21-04-13	MT
China Wafer Level Csp Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2020	21-03-26	CI
China stocks rise on infra boost, Sino-U.S. tensions cap gains	21-03-11	RE
China Wafer Level CSP Co., Ltd. announced that it has received CNY 1.028999666 billion in funding from a group of investors	21-01-13	CI
China Wafer Level Csp Co., Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2020	20-10-18	CI

Chart China Wafer Level CSP Co., Ltd.

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Company Profile

China Wafer Level CSP Co., Ltd is a China-based company principally engaged in the packaging and testing in sensor industry. The main products of the Company include image sensor chips, environment light sensor chips, biometric identification chips, microelectromechanical systems (MEMS), environment light induced chips, medical electronics and radio frequency chips, among others. The Companyâs products are applied in various areas, such as consumer electronics, including mobile phones, computers, cameras and game consoles; security monitoring; identification; automotive electronics; virtual reality; smart cards and medical electronics. The Company distributes its products primarily in overseas markets.

Sector

Semiconductor Equipment & Testing

Calendar

2024-04-29 - Q1 2024 Earnings Release

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Income Statement Evolution

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Analysts' Consensus

Sell

Buy

Mean consensus

BUY

Number of Analysts

Last Close Price

17.56 CNY

Average target price

21 CNY

Spread / Average Target

+19.59%

Consensus

EPS Revisions

Estimates Revisions

Quarterly earnings - Rate of surprise

Company calendar

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