Formosa Advanced Technologies Co., Ltd.

8131

TW0008131004

Semiconductor Equipment & Testing

End-of-day quote Taiwan S.E. Other stock markets 06:00:00 2024-04-25 pm EDT			5-day change	1st Jan Change
36.45 ^TWD	+0.41%		+1.25%	-6.54%

Feb. 23	Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	CI
Feb. 01	Formosa Advanced Technologies Co., Ltd. Announces Change of Chief Information Security Officer	CI

Formosa Advanced Technologies Co., Ltd. Promotes Chang Hsien Cheng to the Acting President

August 03, 2022 at 02:57 am EDT

The board of directors of Formosa Advanced Technologies Co., Ltd. approved the promotion of Mr. Chang Hsien Cheng, the Executive Vice President, to the Acting President on August 3, 2022.

Latest news about Formosa Advanced Technologies Co., Ltd.

Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	Feb. 23	CI
Formosa Advanced Technologies Co., Ltd. Announces Change of Chief Information Security Officer	Feb. 01	CI
Formosa Advanced Technologies Co., Ltd. Appoints Chang Wu-Huang as Members of the Compensation Committee	Dec. 15	CI
Formosa Advanced Technologies Co., Ltd. Announces the Dismissal of Shen Hui Ya, Sustainable Development Committee Member	Nov. 09	CI
Formosa Advanced Technologies Co., Ltd. Announces Demise of Shen Hui Ya, Remuneration Committee Member	Nov. 09	CI
Formosa Advanced Technologies Co., Ltd. Announces the Demise of Shen Hui Ya, Audit Committee Member	Nov. 09	CI
Formosa Advanced Technologies Co., Ltd. Announces Demise of Shen Hui Ya, Independent Director	Nov. 09	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	Nov. 08	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	23-08-02	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-05-03	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	23-02-22	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	22-11-02	CI
Formosa Advanced Technologies Co., Ltd. Appoints Chih-Hao Huang as Chief internal auditor	22-11-02	CI
Formosa Advanced Technologies Co., Ltd. Announces Change of Principal Accounting Officer	22-10-27	CI
Formosa Advanced Technologies Co., Ltd. Announces Removal of Lin Tsai-Hsien as Principal Accounting Officer	22-09-21	CI
Formosa Advanced Technologies Co., Ltd. Appoints Huang Chung-Hou as Chief Information Security Officer	22-09-19	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	22-08-03	CI
Formosa Advanced Technologies Co., Ltd. Promotes Chang Hsien Cheng to the Acting President	22-08-03	CI
Formosa Advanced Technologies Co., Ltd. Resolves to Set Up Sustainable Development Committee	22-06-24	CI
Formosa Advanced Technologies Co., Ltd. Resolves the Compensation Committee Members	22-06-24	CI
Formosa Advanced Technologies Co., Ltd. Announces New Chairman of the Company	22-06-24	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022	22-05-04	CI
Formosa Advanced Technologies Co., Ltd. Announces Resignation of Liao Cheng-Chieh as Principal Accounting Officer	22-03-18	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2021	22-02-24	CI
Formosa Advanced Technologies Co., Ltd. Announces Demise of Hsie, Shih-Ming, Vice Chairman and President	22-01-10	CI

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Formosa Advanced Technologies Co., Ltd. is a Taiwan-based company principally engaged in the provision of integrated circuit (IC) assembly and related testing services and module services. The Company provides services applied in thin small outline packages (TSOPs), small outline packages (SOPs), quad flat packages (QFPs), thin quad flat packages (TQFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light emitting diodes (LED) wafers, among others. The Company operates its businesses principally in Taiwan, Hong Kong and South Korea.

Sector

Semiconductor Equipment & Testing

Calendar

2024-04-30 - Q1 2024 Earnings Release (Projected)

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Sector Semiconductor Testing Equipment & Service

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