GBT Technologies Inc. announced that its continuation-in-part (CIP) patent application covering its photonic, 3D, Multi-Planar, integrated circuit design and manufacturing architecture, was approved for Fast Track processing by the United States Patent and Tradark Office. GBT filed for expedited processing to prioritize the photonic CIP application for faster examination, which will allow for a final disposition within approximately twelve months. The application serial number is 18109291 and the original filing date was February 14, 2023.

The CIP patent application seeks to protect the photonic technology coverage of GBT's 3D, MP microchip design and manufacturing existing invention. A photonic integrated circuit (PIC) is a chip that contains photonic components, which are components that work with light (photonic chip, photons pass through optical components such as waveguides (equivalent to electrical wires), lasers (equivalent to transistors) and similar. GBT presently holds a patent covering its 3D, MP patent technology, which describes a traditional multi-planar technology to design and manufacture ICs, with higher performance and less energy/heat loss for use as microprocessors, controllers, GPUs, memories, and more.

Additionally, the goal for these chips is to increase the traffic speed and bandwidth of data centers, reduce power consumption/heat, lower cost and ultimately help create a "greener world". GBT's CIP patent application seeks to protecting the addition of photonic technology for the next generation of high performance, bandwidth, and efficiency of PICs, making them a vital part of the high-speed technology of the future. The patent application also seeks to protect 3D, MP hybrid technology, combining photonics and conventional circuits.

A hybrid solution offers advantages of photonic circuits working together with conventional ones in a 3D multiplanar structure. GBT plans to continue its R&D efforts in the evolving photonic ICs field, maintain its ongoing strategy to achieve advantageous, pioneering IP in the semiconductor domain. There is no guarantee that the Company will be successful in researching, developing, or implementing this system.

In order to successfully implement this concept, the Company will need to raise adequate capital to support its research and, if successfully researched, developed and granted regulatory approval, the Company would need to enter into a strategic relationship with a third party that has experience in manufacturing, selling and distributing this product. There is no guarantee that the Company will be successful in any or all of these critical steps.