GBT Technologies Inc.'s nonprovisional patent application for predictive, three-dimensional, multi-planar shapes, systems and methods for semiconductor design and manufacturing was granted Fast Track, prioritized processing. Fast innovation is a corporation's competitive edge in the US and worldwide. GBT is interested in acting quickly to protect its 3D, MP integrated Circuits architecture concepts, and the USPTO's TrackOne prioritized examination allows it to get a final dissposition within approximately twelve months.

As GBT gears up to file more patents in this field, the TrackOne program is expected to accelerate the examination time, with the goal of providing IP protection faster and without having to perform a pre- examination search. The goal of the predictive, 3D, MP IC architecture technology is to alleviate to a great extent the disadvantages and problems associated with traditional semiconductor and IC fabrication systems and methods by providing a predictive design and manufacturing technology to determine the best 3D, multi-planar shape for an integrated circuit according to a desired process dimensions and characteristics. The IP calculates the best 3D, MP shape that matches a selected IC design and manufacturing process, considering geometrical design rules, electrical specifications, reliability constraints and DFM (Design for Manufacturing) guidelines.

The described technology aims to work in conjunction with GBT's patented 3D, MP IP in order to achieve the best silicon yield, highest performance, lowest power consumption, and optimal Electro-Thermal dissipation. GBT plans to continue filing patents in this domain, expanding its 3D, multi- planar semiconductor architecture IP in the upcoming months.