Chengdu Silan Semiconductor Manufacturing Co., Ltd. announced that it expects to receive CNY 2.1 billion in funding from Huaxin Investment Management Co., Ltd., Hangzhou Silan Microelectronics Co.,Ltd
March 28, 2023
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Chengdu Silan Semiconductor Manufacturing Co., Ltd. announced a private placement of common shares for the gross proceeds of CNY 2,100,000,000 on March 29, 2023. The transaction will include participation from returning investor Hangzhou Silan Microelectronics Co., Ltd for CNY 1,100,000,000 to subscribe to new registered capital of CNY 833,333,333 and National Integrated Circuit Industry Investment Fund Phase II Co., Ltd. for CNY 1,000,000,000 to subscribe to new registered capital of CNY 757,575,758 representing 23.9% stake, a fund managed by Huaxin Investment Management Co., Ltd. The transaction has been approved in the 6th Meeting of the Company?s 8th Directorate and does not need the shareholders approval.
On April 20, 2023, the company announced that the transaction has been approved by the 2022 Annual General Shareholders Meeting of Hangzhou Silan Microelectronics Co., Ltd.
Hangzhou Silan Microelectronics Co., Ltd. is a China-based company principally engaged in the design, manufacture and sales of electronic components. The Company is also engaged in the importing and exporting of mechanical and electrical products. The Company's main products include integrated circuits, semiconductor discrete devices and light-emitting diode (LED) products. The Company mainly operates its businesses in Zhejiang Province, China.
Chengdu Silan Semiconductor Manufacturing Co., Ltd. announced that it expects to receive CNY 2.1 billion in funding from Huaxin Investment Management Co., Ltd., Hangzhou Silan Microelectronics Co.,Ltd