Inactive Instrument

Hi-P International Limited

Equities

H17

SG1O83915098

Hi-P International Limited Declares A Final Tax Exempt One-Tier Dividend for the Financial Year Ended 31 December 2019

April 08, 2020 at 05:21 am EDT

Hi-P International Limited at its annual general meeting to be held on June 15, 2020 declared a final tax exempt one-tier dividend of SGD 2.0 cents per ordinary share for the financial year ended 31 December 2019. [2018: SGD 4.0 cents per ordinary share].

Latest news about Hi-P International Limited

Hi P International : Delists from Singapore Bourse as Founder Completes Privatization	21-04-20	MT
Hi-P International Limited(SGX:H17) dropped from S&P Global BMI Index	21-03-01	CI
Hi P International : YHT Venture Closes Offer for Hi-P International Shares	21-02-19	MT
Yao Hsiao Tung completed the acquisition of remaining 16.6% stake in Hi-P International Limited.	21-02-17	CI
HI P International : COO for China Business Tenders Resignation	21-02-04	MT
Hi-P International Limited Announces Executive Changes	21-02-04	CI
Hi P International : YHT Venture Raises Hi-P International Stake to 87.89%	20-12-29	MT
Hi P International : Singapore Index Falls on Friday; Hi-P International Jumps 11%	20-12-18	MT
Hi P International : Zooms 11% on Delisting Offer from Chairman and Majority Shareholder	20-12-18	MT
Yao Hsiao Tung made an unconditional offer to acquire remaining 16.6% stake in Hi-P International Limited for approximately SGD 270 million.	20-12-17	CI
Hi-P International Limited Reports Earnings Results for the Half Year Ended June 30, 2020	20-07-29	CI
Hi-P International Limited Provides Group Earnings Guidance for the Second Half and Full Year 2020	20-07-29	CI
Hi-P International Limited Announces Re-Designation of Liu Hsiao-Tsu as Chief Operating Officer, Greater China Business Unit	20-06-30	CI
Hi-P International Limited Announces Re-Designation of Jeffrey Tan as Chief Operating Officer, Overseas Business Unit	20-06-30	CI
Hi-P International Limited Approves Final Tax-Exempt One-Tier Dividend, Payable on 1 July 2020	20-06-15	CI
Hi-P International Limited Announces Update on the Group's Operations in Singapore	20-04-09	CI
Hi-P International Limited Declares A Final Tax Exempt One-Tier Dividend for the Financial Year Ended 31 December 2019	20-04-08	CI
Hi-P International Limited Appoints Zhang Zhijun as Deputy Executive VP of Greater China Operations	20-03-18	CI
Hi-P International Limited Appoints Jeffrey Tan as Executive Vice President	20-03-18	CI
Hi-P International Limited Recommends Final Dividend for the Year Ended 31 December 2019	20-02-13	CI
Hi-P International Limited Reports Earnings Results for the Fourth Quarter Ended December 31, 2019	20-02-13	CI
Hi-P International Limited Announces Appointment of Ho Kheong Chun as Non-Executive Independent Director	19-12-18	CI
Hi-P International Limited Announces Appointment of Seow Choke Meng as Non-Executive Independent Director	19-12-18	CI
Hi-P International Limited Announces Cancellation of the Revolving Credit Facility from HSBC	19-11-05	CI
Hi-P International Limited and Hi-P Electronics Pte. Ltd. Accept Credit Facilities from Citibank	19-11-05	CI

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Company Profile

Hi-P International Limited is an integrated contract manufacturer. The Company is engaged in the design and fabrication of mold (MDF), precision plastic injection molding (PPIM), assembly and provision of ancillary services (surface finishing services). Its segments include Precision plastic injection molding; Mold design and fabrication, Assembly, which is engaged in the provision of sub-product assembly and full-product assembly services. It provides solutions to customers in industries, such as telecommunications, consumer electronics, computing and peripherals, lifestyle, medical and industrial devices from design, electro-mechanical parts, modules to product manufacturing services. It has approximately 10 manufacturing plants located in over six locations in the People's Republic of China (Shanghai, Chengdu, Tianjin, Xiamen, Suzhou and Nantong), Poland, Singapore and Thailand. It has marketing and engineering support centers in China, Singapore, Taiwan and the United States.

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