Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
Delayed
Other stock markets
|
5-day change | 1st Jan Change | ||
15.68 HKD | +1.42% | +8.26% | -16.74% |
Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
1st Jan change | Capi. | |
---|---|---|
-16.74% | 4.28B | |
+77.16% | 2,159B | |
+20.41% | 623B | |
+31.87% | 622B | |
+6.78% | 254B | |
+14.54% | 185B | |
+4.12% | 162B | |
-36.56% | 136B | |
+34.57% | 127B | |
+35.67% | 105B |