Inari Amertron

INARI

MYQ0166OO007

Semiconductors

End-of-day quote BURSA MALAYSIA Other stock markets 06:00:00 2024-06-20 pm EDT			5-day change	1st Jan Change
3.69 ^MYR	0.00%		-3.66%	+22.59%

May. 24	Inari Amertron's Profit, Revenue Rise in Fiscal Q3	MT
May. 23	Inari Amertron Berhad Announces Third Interim Single Tier Dividend for the Year Ending 30 June 2024, payable on July 5, 2024	CI

Inari Amertron Berhad Announces Third Interim Single Tier Dividend for the Year Ending 30 June 2024, payable on July 5, 2024

May 23, 2024 at 08:33 am EDT

Inari Amertron Berhad announced third interim single tier dividend of 1.9 sen per ordinary share for the year ending 30 June 2024. Ex-Date is 07 June 2024. Payment Date is 05 July 2024.

Entitlement date is 10 June 2024.

Latest news about Inari Amertron

Inari Amertron's Profit, Revenue Rise in Fiscal Q3	May. 24	MT
Inari Amertron Berhad Announces Third Interim Single Tier Dividend for the Year Ending 30 June 2024, payable on July 5, 2024	May. 23	CI
Inari Amertron Berhad Reports Earnings Results for the Third Quarter and Nine Months Ended March 31, 2024	May. 23	CI
Penumbra, Inc. : The underdog in healthcare	Apr. 11
Inari Amertron Berhad Reports Earnings Results for the Second Quarter and Six Months Ended December 31, 2023	Feb. 26	CI
Inari Amertron Berhad Proposes Second Interim Single Tier Dividend for the Year Ending June 30, 2024, Payable on 05 April 2024	Feb. 26	CI
Inari Amertron Berhad Appoints ONG ENG BIN as Independent and Non Executive Member of Risk Committee	Jan. 31	CI
Inari Amertron Berhad Appoints DATO ONG ENG BIN as Independent and Non Executive Director	Jan. 31	CI
Inari Amertron Offers Share Options to Directors, Employees	Jan. 10	MT
Chinese firms look to Malaysia for assembly of high-end chips, sources say	Dec. 17	RE
Dialog, Westports Replaced by YTL Power, YTL in Malaysia's KLCI Index	Nov. 30	DJ
Inari Amertron Berhad Announces Retirement of Dato' Sri Chee Hong Leong, Jp as Independent and Non Executive Member of Risk Committee	Nov. 23	CI
Inari Amertron Berhad Announces Retirement of Dato Sri Chee Hong Leong, JP as Independent and Non Executive Director	Nov. 23	CI
Inari Amertron Berhad Reports Earnings Results for the First Quarter Ended September 30, 2023	Nov. 22	CI
Inari Amertron Berhad Announces First Interim Dividend for the Financial Year Ending June 30, 2024, Payable on January 05, 2024	Nov. 22	CI
Inari Amertron Trims Dividend as Profit Drops in Fiscal Q4	23-08-30	MT
Inari Amertron Berhad Reports Earnings Results for the Fourth Quarter and Full Year Ended June 30, 2023	23-08-29	CI
Inari Amertron Berhad Announces Fourth Interim Dividend for the Year Ended June 30, 2023, Payable on 06 October 2023	23-08-29	CI
Inari Amertron Cuts Dividend as Profit Drops in Fiscal Q3	23-05-26	MT
Inari Amertron Berhad Announces Third Interim Single Tier Dividend, Payable on July 7, 2023	23-05-25	CI
Inari Amertron Berhad Reports Earnings Results for the Third Quarter and Nine Months Ended March 31, 2023	23-05-25	CI
Inari Amertron Berhad Appoints Mohamad Azmi Bin Ali as Independent and Non Executive Member of Remuneration Committee	23-03-13	CI
Inari Amertron Berhad Announces Re-Designation of Datuk Phang Ah Tong as Independent and Non Executive Chairman of Remuneration Committee from Independent and Non Executive Member of Remuneration Committee	23-03-13	CI
Inari Amertron Berhad Appoints Dato' Sri Chee Hong Leong, JP as Independent and Non Executive Member of Risk Committee	23-03-13	CI
Inari Amertron Berhad Appoints Datuk Mohamed Arsad Bin Sehan as Independent and Non Executive Chairman of Nomination Committee	23-03-13	CI

Inari Amertron Berhad is a Malaysia-based company that is engaged in the investment holding and the provision of management services. The Company operates as an outsourced semiconductor assembly and test (OSAT) service provider for radio frequency, fiber-optics transceivers, opto-electronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed, and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include new product introduction (NPI) services, sensor and IC package design and characterization.

Sector

Semiconductors

Calendar

2024-08-26 - Q4 2024 Earnings Release (Projected)

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B+

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Mean consensus

OUTPERFORM

Number of Analysts

Last Close Price

3.65 MYR

Average target price

3.552 MYR

Spread / Average Target

-2.69%

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Inari Amertron

Equities

INARI

MYQ0166OO007

Semiconductors

Inari Amertron Berhad Announces Third Interim Single Tier Dividend for the Year Ending 30 June 2024, payable on July 5, 2024

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Sector Other Semiconductors