Infineon Technologies : expands 600 V CoolMOS™ S7 family with MOSFETs for static switching applications
April 08, 2021 at 02:28 am EDT
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Munich, Germany - 8 April 2021 - In applications where MOSFETs are switched at low frequency, high-power product designs must meet several key characteristics: They have to minimize conduction losses, provide optimal thermal behavior, and enable more compact and lighter systems - all while maintaining the highest quality at a low cost. To meet these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is enhancing the 600 V CoolMOS™ S7 family with two new optimized devices for static switching applications: the industrial-grade CoolMOS S7 10 mΩ and the automotive-grade CoolMOS S7A.
The CoolMOS S7 10 mΩ has a unique low on-resistance (R DS(on)) for 600 V superjunction MOSFETs, making it ideal for applications where minimal conduction losses are critical, such as off-the-shelf solid-state relays (SSR). In contrast, the automotive-grade CoolMOS S7A addresses system performance requirements set by solid-state circuit breakers (SSCB) and diode paralleling/replacement for high power/performance designs in automotive applications, such as the High Voltage (HV) eFUSE, HV eDisconnect battery disconnect switch, as well as on-board chargers.
The product family has been developed by optimizing the renowned CoolMOS 7 technology platform. To achieve this, the device has been enhanced for static switching and high current applications. As a result, the new devices can offer the best price-performance ratio at the highest quality standards, placing even greater emphasis on conduction performance, energy efficiency, power density, and improved thermal resistance.
The CoolMOS S7 10 mΩ and CoolMOS S7A chips come with the lowest R DS(on) in the market and best-in-class R DS(on) x A x cost. Additionally, they have been integrated into an innovative top-side cooled (TSC) QDPAK SMD package, which offers excellent thermal behavior, making it a smaller alternative to THD devices such as TO-247. Moreover, with moving from THD to a surface-mounted device with QDPAK, a 94 percent reduction of height can be achieved, enabling higher power density solutions. With the low conduction losses of the CoolMOS™ S7 10 mΩ and the CoolMOS S7A, designers can limit the size of heat sinks up to 80 percent and extend the current and voltage ratings without altering the form factor.
Availability
The CoolMOS S7 10 mΩ and CoolMOS S7A devices can be ordered now in a TSC QDPAK package (HDSOP-22-1). More information is available at www.infineon.com/s7.
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Infineon Technologies AG published this content on 08 April 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 08 April 2021 06:27:06 UTC.
Infineon Technologies AG is one of the world's leading manufacturers of semiconductors. The group's products include power semiconductors, sensors, microcontrollers, digital, mixed-signal and analog ICs, discrete semiconductor modules, switches, interface ICs, motor-controlling ICs, RF power transistors, voltage regulators, and electronic safety components. Net sales break down by area of activity as follows:
- automotive (50.5%): semiconductor products used in the automotive industry, and memory products for specific applications for automotive, industrial, information technologies, telecommunications and consumer electronics.
- power & sensor systems (23.3%): semiconductors for energy-efficient power supplies, mobile devices, mobile phone network infrastructures, human-machine interaction as well as applications with special demands on their robustness and reliability.
- industrial power control (13.5%): semiconductor products for the conversion of electrical energy for small, medium and high-power applications, used in the manufacturing, the low-loss transmission, the storage and the efficient use of electrical energy;
- connected secure systems (12.6%): semiconductors for networked devices, card-based applications, and government documents; microcontrollers for industrial, entertainment, and household applications, components for connectivity systems, various customer support systems;
- other (0.1%).
Net sales are distributed geographically as follows: Germany (12.4%), Europe/Middle East/Africa (14.4%), China/Hong Kong/Taiwan (32.3%), Japan (10.5%), Asia/Pacific (15.9%), the United States (12.1%) and Americas (2.4%).