Inspur Electronic Information Industry Co., Ltd. will attend Hannover Messe 2023 from April 17-21. With a main theme of “Intelligent IT transformation for Manufacturing,” the company will bring its latest and innovative G7 server family, liquid cooling servers, and edge servers that support recent customer cases in manufacturing and drive the digitalization of manufacturing customers throughout Europe. Inspur Electronic Information will join around 4,000 companies from the mechanical engineering, electrical, and digital industries.

Industry leaders would gather to share their insights on topics including digital platform, cloud & infrastrucuture, and digital energy & energy efficiency. Inspur Electronic Information believes that the digitization and optimization of manufacturing is the first step of Industry 4.0, a process where traditional enterprises constantly introduce digital and intelligent technologies and conduct production technology and model innovations based on those technologies in production. This deepens the digital and intelligent integration of supply chain, warehouse, manufacturing, quality control, logistics, delivery, service and other links.

Therefore, manufacturing enterprises need a stable, reliable, efficient, green, and dynamically scalable IT infrastructure that can provide trusted business assurance, cost efficiency, and adaptability. Inspur Electronic Information has computing platform solutions and expansive deployment experiences. At Hannover Messe 2023, the company will bring G7 servers, liquid cooling servers, and edge servers with the newest improvement in reliability, flexibility and sustainability.

These products meet computing requirements in different environments and scenarios, such as data center and edge, and provide manufacturing enterprises with reliable, flexible, and efficient intelligent manufacturing IT architecture solutions. The latest G7 server family will be the highlight at the exhibit, with NF5266G7, NF5280G7, and NF5688G7 making an appearance. The G7 platform delivers an 86% computing performance improvement compared to the previous-generation.

G7 server management module, memory module, network module, and other modules are designed based on open standards and compatible with DC-SCM management module. The open design further improves flexible scalability of the systems. The G7 platform offers reliability from firmware to hardware. Core components such as power supply, BIOS, and BMC adopt full redundancy design.

Up to 95% fault diagnosis accuracy is achieved through cloud operation and maintenance. The G7 platform can be equipped with liquid cooling to lower the PUE as low as 1.1 and features excellent flexibility, energy-savings, and reliability, better facilitating the key applications for intelligent manufacturing transformation.