DDC-I and Intel Bring Safety-Critical Multi-Core Computing to Avionics Displays and High Compute Sensors
September 21, 2021 at 08:00 am EDT
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DDC-I, Inc. announced that it has teamed with Intel to port its Deos™ DO-178C safety-critical real-time operating system and Eclipse-based development tools to Intel's 11th Generation Intel® Core™ i7 multi-core application processor. Intel Core i7 processors running Deos provide an excellent platform for a wide number of applications, including displays and high compute smart sensors. Deos has supported the x86 processor architecture with DAL-A artifacts since 1998, with thousands of x86-based Deos systems certified and flying today. With Intel Core i7 processors, Deos extends its existing support for the Intel Atom®, Xeon®, and other i7 architectures, providing a common certification package and development tools across all these processors, including the DO-330 qualified tools. The Intel Core i7 SoC application processor is the 11th generation of Intel® Core™ architecture. Combining 4 CPU cores operating at up to 4.4 GHz with an Intel® Iris® Xe graphics processor and up to 12 Mbytes of cache, Intel Core i7 features Enhanced Media (AV1 Codec/12b support via 2 VDBOX) and AI/DL Instruction Sets with VNNI support for CV/AI and OpenVINO.
Intel Corporation is the world leading manufacturer of semiconductor. Net sales break down by family of products and services as follows:
- computing architectures products (93.2%): processors and microprocessors (Pentium, Intel Xeon brands, etc.), graphics cards, chips and motherboards, connectivity products, cellular modems, Ethernet controllers, network components, storage products, etc. for PCs, servers, data centers, cloud networks, workstations, notebooks, Internet of Things, graphics architectures, intelligent peripherals and communications infrastructures. The group also develops associated software;
- advanced driving assistance and autonomous driving systems (3.8%; Mobileye);
- wafer manufacturing services (1.8%): accelerators, monolithic chips, silicon wafers, etc. The group also offers chiplet software and mask manufacturing equipment for advanced lithography;
- other (1.2%).
Net sales (including intragroup) are distributed geographically as follows: the United States (25.7%), China (27.4%), Singapore (15.9%), Taiwan (12.7%) and other (18.3%).
INTEL CORPORATION 
