Item 7.01 Regulation FD Disclosure.

On July 26, 2021, Intel Corporation ("Intel") issued a press release providing an update on its manufacturing process and packaging technology roadmaps. As part of the update, Intel also introduced a new naming structure for its manufacturing process nodes, which includes the name changes summarized below:





Previous Process Node Name   New Process Node Name
10nm SuperFin                10nm SuperFin (unchanged)
10nm Enhanced SuperFin       Intel 7
Intel 7nm                    Intel 4

Intel introduced additional future nodes, including Intel 3 and Intel 20A, and discussed future process and packaging technologies, such as its PowerVia, RibbonFET, Foveros Omni, and Foveros Direct technologies, in the update.

The press release is furnished as Exhibit 99.1 to this report. Intel's webcast discussing the update will be available for replay at www.intc.com.

Forward-Looking Statements

This report and the exhibit attached hereto contain forward-looking statements relating to Intel's future plans and expectations, including with respect to Intel's process and packaging technology roadmaps and schedules; innovation cadence; future technology and products and the expected benefits and availability of such technology and products, including PowerVia, RibbonFET, Foveros Omni, and Foveros Direct technologies, future process nodes, and other technologies and products; technology parity and leadership; future use, benefits, and availability of EUV and other manufacturing tools; expectations regarding suppliers, partners, and customers; Intel's strategy; manufacturing plans; manufacturing expansion and investment plans; and plans and goals related to Intel's foundry business. Such statements involve a number of risks and uncertainties. Words such as "anticipates," "expects," "intends," "goals," "plans," "believes," "seeks," "estimates," "continues," "may," "will," "would," "should," "could," "strategy," "progress," "accelerate," "path," "on-track," "roadmap," "pipeline," "cadence," "momentum," "positioned," "committed," and "deliver" and variations of such words and similar expressions are intended to identify forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, and uncertain events or assumptions also identify forward-looking statements. Such statements are based on management's current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in these forward-looking statements. Important factors that could cause actual results to differ materially from the company's expectations include, among others, Intel's failure to realize the anticipated benefits of its strategy and plans; changes in plans due to business, economic, or other factors; actions taken by competitors, including changes in competitor technology roadmaps; changes impacting our projections regarding our technology or competing technology; delays in development or implementation of our future manufacturing technologies or failures to realize the anticipated benefits of such technologies, including expected improvements in performance and other factors; delays or changes in the design or introduction of future products; changes in customer needs or plans; changes in technology trends; our ability to rapidly respond to technological developments; delays, changes in plans, or other disruptions involving manufacturing tool and other suppliers; and other factors set forth in Intel's reports filed or furnished with the Securities and Exchange Commission ("SEC"), including Intel's most recent reports on Form 10-K and Form 10-Q, available at Intel's investor relations website at www.intc.com and the SEC's website at www.sec.gov. Intel does not undertake, and expressly disclaims any duty, to update any statement made in this report and the exhibit attached hereto, whether as a result of new information, new developments or otherwise, except to the extent that disclosure may be required by law.

The information in Item 7.01 of this report and the exhibit attached hereto are furnished and shall not be treated as filed for purposes of the Securities Exchange Act of 1934, as amended.


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Item 9.01 Financial Statements and Exhibits.

(d) Exhibits.

The following exhibits are provided as part of this report:





Exhibit     Description

99.1          Press release titled "Intel Accelerates Process and Packaging
            Innovations," issued by Intel on July 26, 2021

104         Cover Page Interactive Data File, formatted in Inline XBRL and
            included as Exhibit 101

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