Kinsus Interconnect Technology Corp.

3189

TW0003189007

Semiconductors

End-of-day quote Taiwan S.E. Other stock markets 06:00:00 2024-04-25 pm EDT			5-day change	1st Jan Change
97 ^TWD	+0.21%		+3.19%	-2.71%

Feb. 19	Kinsus Interconnect Technology Corp. Reports Earnings Results for the Full Year Ended December 31, 2023	CI
2023	Kinsus Interconnect Technology Corp. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	CI

Kinsus Interconnect Technology Corp. Announces Board Changes

August 01, 2023 at 03:33 am EDT

Kinsus Interconnect Technology Corp. announced resignation of Hu, Gui-Qin, Chief Operating Director as representative of juristic person director and appointed Cheng, Kuang-Chih, President and Co-CEO of Pegatron Corporation as representative of juristic person director. Effective date of the new appointment is August 1, 2023.

Latest news about Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp. Reports Earnings Results for the Full Year Ended December 31, 2023	Feb. 19	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	Nov. 02	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	23-08-09	CI
Kinsus Interconnect Technology Corp. Announces Board Changes	23-08-01	CI
Kinsus Interconnect Technology Corp. Announces the Resignation of Hu, Gui-Qin as Chief Operating Director	23-07-31	CI
Kinsus Interconnect Technology Corp. Approves Dividend Distribution, Payable on August 9, 2023	23-06-28	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-04-27	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Full Year Ended December 31, 2022	23-02-23	CI
Kinsus Interconnect Technology Corp. Provides Revenue Guidance for 2023	22-12-07	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	22-10-31	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	22-08-01	CI
Shares of Major Taiwanese ABF Substrate Producers Underperform in Previous Week	22-06-20	MT
Kinsus Interconnect Technology Corp. Reports Earnings Results for the First Quarter Ended March 31, 2022	22-04-25	CI
Kinsus Interconnect Technology Corp. Appoints Sih-Jheng Liao as Deputy CSO, Effective May 01, 2022	22-04-25	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Full Year Ended December 31, 2021	22-02-15	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	21-10-28	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Second Quarter Ended June 30, 2021	21-07-26	CI
Kinsus Interconnect Technology Corp. Announces CEO Change	21-07-12	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the First Quarter Ended March 31, 2021	21-04-25	CI
Kinsus Interconnect Technology Corp. Announces Acquisition of Clean Room Air-Conditioning Project	21-03-30	CI
Kinsus Interconnect Technology Corp. to Acquire Property, Plant and Equipment in Taoyuan	21-02-03	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Third Quarter Ended September 30, 2020	20-10-25	CI
Kinsus Interconnect Technology Corp. acquired Plant and related facilities of Chunghwa Picture Tubes, Ltd. for TWD 1.5 billion.	20-08-12	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the Second Quarter Ended June 30, 2020	20-07-26	CI
Kinsus Interconnect Technology Corp. Reports Earnings Results for the First Quarter Ended March 31, 2020	20-04-26	CI

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Company Profile

Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.

Sector

Semiconductors

Calendar

2024-04-28 - Q1 2024 Earnings Release

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Ratings for Kinsus Interconnect Technology Corp.

Trading Rating

Investor Rating

ESG Refinitiv

C+

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Analysts' Consensus

Sell

Buy

Mean consensus

HOLD

Number of Analysts

Last Close Price

97 TWD

Average target price

98.78 TWD

Spread / Average Target

+1.83%

Consensus

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Quarterly earnings - Rate of surprise

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Sector Integrated Circuits

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Integrated Circuits