Montage Technology Co., Ltd.

688008

CNE100003MN7

Semiconductors

End-of-day quote Shanghai S.E. Other stock markets 06:00:00 2024-04-25 pm EDT			5-day change	1st Jan Change
50.77 ^CNY	+5.11%		+10.61%	-13.60%

Apr. 25	Montage Technology Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	CI
Apr. 03	Tranche Update on Montage Technology Co., Ltd.'s Equity Buyback Plan announced on February 5, 2024.	CI

Hangzhou Gold Electronic Equipment Co., Ltd. announced that it has received CNY 100 million in funding from Shenzhen Kunpeng Yichuang Private Equity Investment Management Co., Ltd., Montage Technology Co., Ltd., GP Capital Co., Ltd.

January 03, 2024

Hangzhou Gold Electronic Equipment Co., Ltd. announced that it has raised over CNY 100 million in a round of funding on January 4, 2024. The transaction included the participation from new investors Shenzhen Kunpeng Yichuang Private Equity Investment Management Co., Ltd., Montage Technology Co., Ltd. and GP Capital Co., Ltd.

Latest news about Montage Technology Co., Ltd.

Montage Technology Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	Apr. 25	CI
Tranche Update on Montage Technology Co., Ltd.'s Equity Buyback Plan announced on February 5, 2024.	Apr. 02	CI
Montage Technology to Buy Up to 106 Million Yuan Assets From Intel	Mar. 07	MT
Montage Technology's 2023 Profit Falls, EPS Misses Estimates	Feb. 26	MT
Montage Technology Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	Feb. 26	CI
Tranche Update on Montage Technology Co., Ltd.'s Equity Buyback Plan announced on August 23, 2023.	Feb. 05	CI
Montage Technology Co., Ltd. announces an Equity Buyback for CNY 600 million worth of its shares.	Feb. 05	CI
Montage Technology Co., Ltd.'s Equity Buyback announced on August 23, 2023, has closed with 7,390,000 shares, representing 0.7% for CNY 386 million.	Feb. 03	CI
Montage Technology Co., Ltd. authorizes a Buyback Plan.	Feb. 03	CI
Montage Technology's 2023 Profit to Drop Up to 66.1%	Jan. 29	MT
Montage Technology Introduces 4th-Gen DDR5 RCDs Enabling Data Rates up to 7200 MT/s	Jan. 04	CI
Hangzhou Gold Electronic Equipment Co., Ltd. announced that it has received CNY 100 million in funding from Shenzhen Kunpeng Yichuang Private Equity Investment Management Co., Ltd., Montage Technology Co., Ltd., GP Capital Co., Ltd.	Jan. 03	CI
Tranche Update on Montage Technology Co., Ltd.'s Equity Buyback Plan announced on August 23, 2023.	Jan. 02	CI
Montage Technology Co., Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2023	23-10-30	CI
Montage Technology Leads in Trial Production of 3rd-Gen DDR5 RCDs	23-10-27	CI
Tranche Update on Montage Technology Co., Ltd.'s Equity Buyback Plan announced on August 23, 2023.	23-10-09	CI
Beijing Fourth Paradigm Technology Raises HK$835.5 Million in Hong Kong IPO, Prices at Bottom of Range	23-09-26	MT
Beijing Fourth Paradigm Technology Launches Up to HK$1.13 Billion Hong Kong IPO	23-09-17	MT
Montage Technology Co., Ltd. Reports Earnings Results for the Half Year Ended June 30, 2023	23-08-23	CI
Montage Technology Co., Ltd. announces an Equity Buyback for CNY 600 million worth of its shares.	23-08-23	CI
Montage Technology Co., Ltd. authorizes a Buyback Plan.	23-08-22	CI
Certain A Shares of Montage Technology Co., Ltd. are subject to a Lock-Up Agreement Ending on 22-JUL-2023.	23-07-21	CI
Sanctioned China stocks win sudden boost from patriotic buyers	23-05-26	RE
Montage Technology Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-04-27	CI
Montage Technology Books 57% Jump in 2022 Profit	23-02-23	MT

Chart Montage Technology Co., Ltd.

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Company Profile

Montage Technology Co Ltd is a China-based company mainly engaged in data processing and interconnect chip design. The Company mainly includes two product lines, interconnection chip product line and Jindai Server Platform product line. The interconnection chip products include Memory Interface chips, Memory Module Supporting chips, PCIe Retimer chips and others. The Jindai Server Platform products include Jindai Server Central Processing Unit (CPU) and Hybrid Secure Memory Module. The Company's products are sold to domestic and foreign markets.

Sector

Semiconductors

Calendar

2024-08-22 - Q2 2024 Earnings Release (Projected)

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Ratings for Montage Technology Co., Ltd.

Trading Rating

Investor Rating

ESG Refinitiv

C-

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Analysts' Consensus

Sell

Buy

Mean consensus

BUY

Number of Analysts

Last Close Price

50.77 CNY

Average target price

71.04 CNY

Spread / Average Target

+39.92%

Consensus

EPS Revisions

Estimates Revisions

Quarterly earnings - Rate of surprise

Company calendar

Sector Memory Chips (RAM)

	1st Jan change	Capi.
MONTAGE TECHNOLOGY CO., LTD.	-13.60%	7.91B
SHENZHEN LONGSYS ELECTRONICS CO., LTD.	+6.26%	5.57B
PHISON ELECTRONICS CORP.	+36.54%	4.31B
TRANSCEND INFORMATION, INC.	+13.40%	1.2B
ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD.	+2.14%	1.14B
PUYA SEMICONDUCTOR (SHANGHAI) CO., LTD.	+1.97%	1.04B
SMART GLOBAL HOLDINGS, INC.	-3.12%	959M
SINO WEALTH ELECTRONIC LTD.	-13.90%	921M
MOTORCOMM ELECTRONIC TECHNOLOGY CO., LTD.	-32.01%	742M
JEJU SEMICONDUCTOR CORP.	+62.41%	539M

Memory Chips (RAM)

Montage Technology Co., Ltd.

Equities

688008

CNE100003MN7

Semiconductors

Hangzhou Gold Electronic Equipment Co., Ltd. announced that it has received CNY 100 million in funding from Shenzhen Kunpeng Yichuang Private Equity Investment Management Co., Ltd., Montage Technology Co., Ltd., GP Capital Co., Ltd.

EPS Revisions