MPI CORPORATION MPI Corporation's Advanced Semiconductor Test Division, an industry and innovation leader of semiconductor test solutions initiated the integration of the TS3500-SE automated wafer probe test system with WaferWallet MAX, a multi-purpose cassette, FOUP self-docking 200 mm and 300 mm handling solution, into a leading WLR test process. The WaferWallet®MAX provides an automation solution by increasing overall testing time over 400% without compromising measurement accuracy and capability. It increases testing efficiency and productivity further by reducing temperature soaking time (part of the overall test time), while enabling hot/cold wafer swapping – which is a unique capability of loading and unloading wafers while the chuck remains at any test temperature.
MPI successfully collaborates with imec for integration of its WaferWallet®MAX solution in imec's Advanced Reliability Robustness and Test (AR²T) department, leveraging their 200 and 300mm WLR qualification activities in support of their Logic, Insite and Memory R&D programs.
