Nextronics Engineering Corp. (GTSM:8147) announced a private placement of 600 unsecured convertible bonds at a price of TWD 100,000 per bond for gross proceeds of TWD 60,000,000 on August 14, 2020. The transaction included participation from returning investor SINBON Electronics Co., Ltd. (TSEC:3023).
End-of-day quote
Other stock markets
|
5-day change | 1st Jan Change | ||
104.5 TWD | +3.98% | +10.00% | +41.60% |
1st Jan change | Capi. | |
---|---|---|
+41.60% | 104M | |
+3.52% | 149B | |
+32.42% | 131B | |
+18.33% | 129B | |
+10.91% | 62.75B | |
+6.71% | 41.08B | |
+93.90% | 35.49B | |
+6.77% | 32.3B | |
-11.79% | 32.08B | |
+2.93% | 27.38B |
- Stock Market
- Equities
- 8147 Stock
- News Nextronics Engineering Corp.
- Nextronics Engineering Corp. announced that it has received TWD 60 million in funding from SINBON Electronics Co., Ltd.