Kunshan TXD Chip Packaging and Testing Technology Co., Ltd. announced that it will receive CNY 240,000,000 in an equity round of funding on October 18, 2023. The transaction will include participation from returning investor Shenzhen TXD Technology Co.,Ltd., and new investor Riyuexin Semiconductor (Kunshan) Co., Ltd. This has been approved in the fourth meeting of the fourth board of directors. Post-completion of the transaction, the registered capital of the company will increase from CNY 750,000,000 to CNY 990,000,000.

The transaction is expected to close before December 15, 2027. The transaction is expected to happen in tranches.