Techbond Group Berhad announced that the company has approved the final single-tier dividend of 0.75 sen per ordinary share amounting to approximately RM3.98 million in respect of the financial year ended 30 June 2023, has been approved by the shareholders at the 7th Annual General Meeting on 29 November 2023. The entitlement of the final single-tier dividend will be determined based on shareholders registered in the record of depositors as at 1 December 2023 and the payment date will be on 15 December 2023.