Today's Information

Provided by: WAH LEE INDUSTRIAL CORP.
SEQ_NO 2 Date of announcement 2022/08/09 Time of announcement 14:37:33
Subject 
 Announcement of the Company's Board of Directors
resolving to issue no.1 of domestic secured corporate
bonds
Date of events 2022/08/09 To which item it meets paragraph 11
Statement 
1.Date of the board of directors resolution:2022/08/09
2.Name [issue no.__ of (secured, unsecured) corporate bonds of
___________ (company)]:Issue no. 1 of domestic secured
corporate bonds of Wah Lee Industrial Corp.
3.Whether to adopt shelf registration (Yes/No):No.
4.Total amount issued:Total amount of par value up to NTD 2 billion.
5.Face value per bond:NTD 1,000,000
6.Issue price:At Par
7.Issuance period:Not to exceed five years
8.Coupon rate:Fixed coupon rate, the Company's chairman
was authorized to decide the coupon rate based on market
condition
9.Types, names, monetary values and stipulations of collaterals:
bank guarantee
10.Use of the funds raised by the offering and utilization plan:
To repay the bank borrowings and
fulfil the mid to long-term working capital needs
11.Underwriting method:issue to public
12.Trustees of the corporate bonds:
The Company's chairman was authorized to decide
13.Underwriter or agent:
The Company's chairman was authorized to decide
14.Guarantor(s) for the issuance:Bank Guarantee
15.Agent for payment of the principal and interest:
The Company's chairman was authorized to decide
16.Certifying institution:None
17.Where convertible into shares, the rules for conversion:NA
18.Sell-back conditions:None
19.Buyback conditions:None
20.Reference date for any additional share exchange, stock swap, or
subscription:NA
21.Possible dilution of equity in case of any additional share exchange,
stock swap, or subscription:NA
22.Any other matters that need to be specified:
The board of directors authorized the chairman to handle
all relevant matters with full authority.

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Wah Lee Industrial Corporation published this content on 09 August 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 09 August 2022 09:05:07 UTC.