Hefei Zhongwen Jintai Semiconductor Investment Co., Ltd announced that it expects to receive CNY 500 million in funding from Wingtech Technology Co., Ltd.
March 26, 2018
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Hefei Zhongwen Jintai Semiconductor Investment Co., Ltd announced that it will receive CNY 500,000,000 in an equity round of funding on March 27, 2018. The transaction will include participation from existing investor Wingtech Technology Co., Ltd. (SHSE:600745) to maintain its 100% stake in the company. Post closing, the registered capital of the company will increase from CNY 5,000,000 to CNY 505,000,000. The transaction has been approved at the 23rd meeting of the investor's 9th directorate and does not need its shareholder's approval.
WINGTECH TECHNOLOGY CO., LTD, formerly JOIN-IN (HOLDING) CO.,LTD., is a China-based company principally engaged in the research, development and manufacture of mobile terminals and smart hardware products. The Company operates three business segments. The Electronic Equipment Manufacturing Business segment is mainly engaged in the research and manufacturing of mobile internet equipment products mainly based on smart phones. The Real Estate and Hotel Supporting Business segment is principally engaged in real estate development and operation, property management, hotel investment and hotel management. The Investment Management Business segment is principally engaged in investment management business. The Company's main products include mobile communication products and mobile communication equipment and commercial housing. The Company operates its businesses within the domestic market and to overseas markets.
Hefei Zhongwen Jintai Semiconductor Investment Co., Ltd announced that it expects to receive CNY 500 million in funding from Wingtech Technology Co., Ltd.
WINGTECH TECHNOLOGY CO.,LTD 
