WINPAC Inc.

A097800

KR7097800007

Semiconductors

End-of-day quote Korea S.E. Other stock markets 06:00:00 2024-04-25 pm EDT			5-day change	1st Jan Change
1,180 ^KRW	-2.07%		-14.24%	-26.30%

Apr. 12	WINPAC Inc. announced that it expects to receive KRW 18.564682948 billion in funding	CI
2023	WINPAC Inc. announced that it has received KRW 12 billion in funding	CI

WINPAC Inc. cancelled the acquisition of 7.39% stake in Transdermal Specialties Global Inc.

April 11, 2017

WINPAC Inc. (KOSDAQ:A097800) agreed to acquire 7.39% stake in Transdermal Specialties Global Inc. for KRW 4.6 billion on April 12, 2016. WINPAC Inc. will acquire 2.65 million shares. The transaction is expected to close on April 20, 2016. WINPAC Inc. (KOSDAQ:A097800) cancelled the acquisition of 7.39% stake in Transdermal Specialties Global Inc. on April 12, 2017.

Latest news about WINPAC Inc.

WINPAC Inc. announced that it expects to receive KRW 18.564682948 billion in funding	Apr. 11	CI
WINPAC Inc. announced that it has received KRW 12 billion in funding	23-08-01	CI
WINPAC Inc. announced that it expects to receive KRW 12 billion in funding	23-07-30	CI
WINPAC Inc. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-05-15	CI
WINPAC Inc. announced that it has received KRW 11.99999955 billion in funding	22-10-16	CI
WINPAC Inc. announced that it expects to receive KRW 11.99999955 billion in funding	22-10-06	CI
ABOV Semiconductor Co., Ltd. completed the acquisition of14.34% stake in WINPAC Inc. from TLi Inc., Sensona Inc. and Dal-Soo Kim.	21-12-21	CI
WINPAC Inc. announced that it has received KRW 14.99999832 billion in funding from ABOV Semiconductor Co., Ltd.	21-11-16	CI
ABOV Semiconductor Co., Ltd. agreed to acquire 14.34% stake in WINPAC Inc. from TLi Inc., Sensona Inc. and Dal-Soo Kim for KRW 24 billion.	21-11-08	CI
WINPAC Inc. announced that it expects to receive KRW 14.99999832 billion in funding from ABOV Semiconductor Co., Ltd.	21-11-08	CI
WINPAC Inc. announced that it has received KRW 5 billion in funding	21-06-10	CI
WINPAC Inc. announced that it expects to receive KRW 5 billion in funding	21-06-08	CI
WINPAC Inc. announced that it expects to receive KRW 999.999 million in funding	19-08-13	CI
WINPAC Inc. announced that it has received KRW 6 billion in funding from Shinhan Investment Corp., Investment Arm and other investors	19-04-04	CI
WINPAC Inc. announced that it expects to receive KRW 6 billion in funding from Shinhan Investment Corp., Investment Arm	19-04-02	CI
WINPAC Inc. announced that it has received KRW 4.5 billion in funding from Sensona Inc.	17-08-16	CI
WINPAC Inc. announced that it expects to receive KRW 4.5 billion in funding from Sensona Inc.	17-08-13	CI
WINPAC Inc. cancelled the acquisition of 7.39% stake in Transdermal Specialties Global Inc.	17-04-11	CI
WINPAC Inc. agreed to acquire 7.39% stake in Transdermal Specialties Global Inc. for KRW 4.6 billion.	16-04-11	CI
WINPAC Inc. announced that it has received KRW 13 billion in funding from Kell Cosmetics Co., Ltd., Heartnex Co., Ltd., KTB Network Co., Ltd., Incheon City Gas Co., Ltd., and other investors.	16-02-17	CI
Bum-Seok Oh acquired an additional 0.68% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 670 million.	16-02-04	CI
Hye-Kyoung Yang, Sae-Hoon Yang and Soo-Hyun Choi acquired 2.73% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 2.8 billion.	16-02-04	CI
Soo-Hyun Choi, Bum-Seok Oh and Soon-Jin Kim acquired 3.41% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 3.4 billion.	16-02-04	CI
WINPAC Inc. announced that it expects to receive KRW 20 billion in funding from a group of investors.	16-02-03	CI
Kyoung-Hoon Lee acquired 2.75% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 2.6 billion.	16-01-11	CI

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Company Profile

WINPAC INC. is a Korea-based company mainly engaged in the semiconductor business. The Company provides package products and testing services. Its package products consist of fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP), flip chips, universal serial bus (USB) flash drive (UFD), solid state drive (SSD) and others. The Company offers testing on memory products, such as dynamic random-access memory (DRAM), static random-access memory (SRAM), flash and pseudo-static random-access memory (PSRAM). It also provides semiconductor test services. The Company provides its services with domestic market and to overseas markets.

Sector

Semiconductors

Calendar

2024-05-12 - Q1 2024 Earnings Release (Projected)

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