Yamaichi Electronics : Notice Regarding Dividend of Surplus
May 17, 2024 at 02:11 am EDT
Share
YAMAICHI ELECTRONICS CO., LTD.
Stock listing: Tokyo Stock Exchange - Prime Market
Code: 6941
President: Junichi Kameya
Managing Director: Kazuhiro Matsuda
Tel: +81-3-3734-0115
May 14, 2024
Notice Regarding Dividend of Surplus
We hereby announce that at the board of directors meeting held on May 14, 2024, our company resolved to pay dividends from surplus with March 31, 2024 as the record date. This matter is scheduled to be discussed at the 69th Ordinary General Meeting of Shareholders scheduled to be held on June 26, 2024. Details are as follows:
1. Dividend details
Latest dividend
Previous period
Determined amount
forecast
results
(Published on November
(Fiscal year ending
7, 2023)
March 2023)
Reference date
March 31, 2024
March 31, 2024
March 31, 2023
Dividend per
13 yen
12 yen
69 yen
share
Total dividend
265 million yen
-
1,430 million yen
amount
Effective date
June 27, 2024
-
June 29, 2023
Dividend source
an earned surplus
-
an earned surplus
2. Reason
Our group has announced that we aim for a dividend payout ratio of 30% in our three- year medium-term management plan (fiscal year ending March 2024 to fiscal year ending March 2026) starting in fiscal year 2023. As part of our efforts to improve shareholder returns, we have decided on the amount of year-end dividends.
Reference
Dividend per share
Second quarter
End of term
Total
dividend
dividend
Results e for the
current period
18 yen
13 yen
31 yen
(Fiscal year ending
March 2024)
Previous period
results (Fiscal year
35 yen
69 yen
104 yen
ending March 2023)
Attachments
Original Link
Original Document
Permalink
Disclaimer
YAMAICHI Electronics Co. Ltd. published this content on
17 May 2024 and is solely responsible for the information contained therein. Distributed by
Public, unedited and unaltered, on
17 May 2024 06:10:34 UTC.
YAMAICHI ELECTRONICS CO., LTD. is mainly engaged in the manufacture and sale of integrated circuit (IC) sockets and structure components. The Test Solution segment is involved in the provision of burn-in sockets, test sockets, probe pins, probe cards, as well as semiconductor test-related services. The Connector Solution segment is involved in the provision of various connectors and IC sockets for mounting use. The Optical-related segment offers filter products for optical equipment and optical communications. The Electronics Manufacturing Service (EMS) segment is engaged in the manufacture and sale of liquid-crystal-related components, as well as the assembling of printed boards for hard disc drives(HDD) and printers.