The initial order includes a FOX-NP™ full wafer system and multiple DiePak Carriers® to be used to meet this customer’s new product requirements and initial production needs. The system is configured with two blades which allows for both wafer level as well as singulated die and module level test and burn-in using Aehr’s proprietary full wafer WaferPak Contactors or singulated die and module DiePak Carriers. The system ships within Aehr’s current fiscal first quarter ending
“A key capability that this customer uses on our
“Our device specific DiePaks include multiple options for testing including the ability to precisely provide accurate voltage, currents, and digital signals as well as monitor temperature, optical output power, input or output voltages, input or output currents, input and output power, as well as digital signatures from a device such as internal registers, temperatures, and individual device IDs for 100% traceability.
“We continue to be very optimistic about the silicon photonics and photonics sensors markets and believe they will be significant growth drivers for Aehr. The rapid growth of integrated optical devices in data centers and data center interconnect infrastructure, mobile devices, automotive applications, and now wearable biosensor markets is driving substantially higher requirements for initial quality and long-term reliability, and they are increasing with every new product generation. We believe these new applications are driving an entirely new level of quality and reliability expectation for these systems and pose a significant long-term growth opportunity for Aehr.”
The FOX-XP system, available with multiple WaferPak Contactors (full wafer test) or multiple DiePak™ Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as silicon carbide power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.
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Safe Harbor Statement
This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates,” “going to,” "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr’s new and existing customers; bookings forecasted for proprietary WaferPak™ and DiePak consumables; and expectations related to long-term demand for Aehr’s productions and the attractiveness of key markets. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s Form 10-K for fiscal 2020, Form 10-Q for the first fiscal quarter of fiscal 2021 and other reports filed from time to time with the
Contacts: | |
MKR Investor Relations Inc. | |
EVP of Sales & Marketing | Analyst/Investor Contact |
(510) 623-9400 x215 | (323) 468-2300 |
vrogers@aehr.com | aehr@mkr-group.com |
Source:
2021 GlobeNewswire, Inc., source