Aehr Test Systems announced it has received an initial customer order for a FOX-NP wafer level test and burn-in system and a FOX WaferPak Aligner to be used for gallium nitride (GaN) power devices. The customer is a leading global supplier of semiconductor devices used in electric vehicles and power infrastructure and adds another major customer to the list of companies using Aehr's FOX products for wafer level test and Burn-in of wide bandgap compound semiconductors. The FOX-NP system, including the FOX WaferPak Aligner, is scheduled to ship and be installed in the current fiscal quarter.

As Aehr's first gallium nitride customer to order a system, this company selected Aehr due in part to its unique ability to offer a total solution that allows customers to apply thermal and electrical stress conditions to thousands of devices while still in wafer form. Aehr's cutting-edge technology provides critical geolocation information across the wafer while inducing the extrinsic (early life) failures that would otherwise fail in the field without reducing the long-term reliability or life of the good devices. Aehr enables its customers to cost-effectively implement the needed testing and qualification process for semiconductor devices that experience early life failures by not only applying the electrical stress condition to every device on the wafer but by also testing up to 18 wafers at a time using the FOX-XP production test and burn in system.

These electrical tests are done with up to thousands of precise calibrated electrical source and measurement instruments per wafer. These tests are done while maintaining the temperature at an accurately programmed thermal temperature across each of the wafers using a direct conduction thermal transfer via a proprietary patented precision thermal chuck per wafer. The FOX-NP compliments Aehr's production FOX-XP system by using the exact same test ?Blades' that are in the FOX-XP to allow 100% correlation between the results on the FOX-NP to the FOX-XP.

The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.