BE Semiconducteurs (Besi) is up 3% in Amsterdam, after announcing a major order for 26 hybrid bonding systems from a second-tier logic semiconductor manufacturer on Wednesday evening.

The order, for its latest-generation system, is due for delivery in the last quarter of 2024 and the first quarter of 2025, with the Dutch company anticipating further orders of the same type from other customers in the second quarter of 2024.

This helps confirm the favorable long-term outlook and anticipated roadmap for Besi's hybrid bonding systems for computational applications over the next decade", comments CEO Richard Blickman.

Copyright (c) 2024 CercleFinance.com. All rights reserved.