Valuation: CHPMS TCHNLGS

Market Cap 80.85B 2.53B 2.25B 2.1B 1.91B 3.6B 244B 3.65B 25.42B 9.84B 124B 9.5B 9.29B 398B P/E 2026 *
24.8x
P/E 2027 * 17.4x
Enterprise Value 85.71B 2.68B 2.38B 2.23B 2.03B 3.82B 258B 3.87B 26.95B 10.43B 132B 10.07B 9.85B 422B EV / Sales 2026 *
2.83x
EV / Sales 2027 * 2.52x
Free-Float
77.34%
Yield 2026 *
1.9%
Yield 2027 * 3.05%
Manager TitleAgeSince
Chief Executive Officer 67 1997-07-16
Director of Finance/CFO 54 2017-09-30
Chief Operating Officer - 2012-03-05
Director TitleAgeSince
Chairman 67 1997-07-16
Director/Board Member 69 2007-06-27
Director/Board Member 70 2013-06-16
Change 5-day change 1-year change 3-year change Capi.($)
+2.20%+7.21%+86.01%+193.39% 691B
+3.53%+10.72%+138.18%+442.62% 426B
+3.50%+11.61%+143.09%+282.30% 420B
+2.77%+7.07%+77.46%+336.77% 261B
-3.82%+7.04%+117.27%+199.80% 182B
+2.71%+13.62%+156.76%+798.16% 173B
+1.00%+1.57%+335.58%+548.40% 97.7B
-2.07%-5.68%+36.17%+244.62% 66.59B
+3.71%+7.25%+194.64%+313.89% 65B
Average +0.52%+6.76%+142.80%+373.33% 264.6B
Weighted average by Cap. +1.27%+7.86%+123.79%+333.04%

Financials

2026 *2027 *
Net sales 30.3B 948M 842M 787M 718M 1.35B 91.27B 1.37B 9.53B 3.69B 46.48B 3.56B 3.48B 149B 35.27B 1.1B 980M 917M 835M 1.57B 106B 1.59B 11.09B 4.29B 54.11B 4.14B 4.05B 174B
Net income 3.28B 103M 91.15M 85.24M 77.68M 146M 9.88B 148M 1.03B 399M 5.03B 385M 377M 16.16B 4.7B 147M 131M 122M 111M 209M 14.15B 212M 1.48B 572M 7.21B 552M 540M 23.15B
Net Debt 4.86B 152M 135M 126M 115M 217M 14.65B 220M 1.53B 592M 7.46B 571M 559M 23.97B 8.02B 251M 223M 208M 190M 358M 24.15B 362M 2.52B 976M 12.3B 942M 922M 39.51B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
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Global
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ESG MSCI
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