Valuation: CHPMS TCHNLGS

Market Cap 49.07B 1.5B 1.34B 1.23B 1.12B 2.11B 141B 2.18B 14.79B 5.9B 75.07B 5.62B 5.5B 237B P/E 2026 *
15.1x
P/E 2027 * 10.6x
Enterprise Value 53.93B 1.65B 1.48B 1.35B 1.23B 2.32B 155B 2.39B 16.25B 6.48B 82.51B 6.17B 6.04B 260B EV / Sales 2026 *
1.77x
EV / Sales 2027 * 1.62x
Free-Float
80.54%
Yield 2026 *
3.13%
Yield 2027 * 5.03%
Manager TitleAgeSince
Chief Executive Officer 67 1997-07-16
Director of Finance/CFO 54 2017-09-30
Chief Operating Officer - 2012-03-05
Director TitleAgeSince
Chairman 67 1997-07-16
Director/Board Member 69 2007-06-27
Director/Board Member 70 2013-06-16
Change 5-day change 1-year change 3-year change Capi.($)
+2.69%-9.14%+43.37%+116.93% 536B
+4.22%-14.71%+42.47%+137.04% 253B
+8.23%-16.17%+23.58%+213.65% 231B
+6.69%-12.30%+14.80%+177.61% 169B
-4.99%-24.35%+36.76%+609.42% 135B
-5.60%-17.66%+23.81%+96.18% 125B
-7.87%-22.84%+124.26%+348.51% 76.11B
-0.18%+12.61%+41.12%+194.12% 61.2B
+2.57%-20.47%+17.94%+149.08% 33.21B
Average +0.70%-14.78%+40.90%+226.95% 180.11B
Weighted average by Cap. +2.33%-15.69%+38.55%+194.00%

Financials

2026 *2027 *
Net sales 30.44B 928M 833M 761M 695M 1.31B 87.27B 1.35B 9.17B 3.66B 46.57B 3.48B 3.41B 147B 35.27B 1.08B 965M 882M 805M 1.52B 101B 1.56B 10.63B 4.24B 53.95B 4.04B 3.95B 170B
Net income 3.28B 100M 89.72M 82M 74.85M 141M 9.4B 145M 988M 394M 5.02B 375M 367M 15.84B 4.7B 143M 128M 117M 107M 202M 13.47B 208M 1.42B 564M 7.19B 538M 526M 22.68B
Net Debt 4.86B 148M 133M 122M 111M 209M 13.95B 216M 1.47B 585M 7.44B 557M 545M 23.49B 8.02B 245M 219M 200M 183M 345M 22.99B 356M 2.42B 963M 12.27B 918M 898M 38.72B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
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Trader
Investor
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Global
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Quality
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ESG MSCI
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MarketScreener Ratings - CHPMS TCHNLGS