Teramount announced that it is collaborating with GlobalFoundries (GF) to address the challenge of connecting fibers to silicon Photonics (SiPh) chips, to meet the ever-growing bandwidth demands and power challenges in datacom and telecom applications. As part of this collaboration, Teramount integrates its Universal Photonic Coupler solution with GF's 45CLO silicon photonics platform, GF FotonixTM, to provide a scalable fiber packaging solution to customers who want to utilize high-speed optical connectivity for applications like AI/ML and data center. This collaboration will enable deeper integration of optics into semiconductor through a variety of innovative packaging technologies which provide scalability of bandwidth, power and latency performance to next generations of advanced computing applications.